MTZJ SERIES ZENER DIODES

MTZJ SERIES ZENER DIODES

文件：34.34 Kbytes 页数：2 Pages

LRC

乐山无线电

500mW Hermetically Sealed Glass Zener Diodes

FEATURES - Zener voltage range : 2.0V to 39V - DO-34 package (JEDEC DO-204) - Through-hole device type mounting - Hermetically sealed glass - Compression bonded construction - All external surfaces are corrosion resistant and leads are readily solderable - RoHS compliant - Solder hot dip T

文件：126.07 Kbytes 页数：5 Pages

TSC

台湾半导体

Axial Lead Zener Diodes

Features: * High reliability * Very sharp reverse characteristic * Low reverse current level Applications: * Voltage Stabilization Mechanical Data: * Case : DO-34 Glass Case * Weight : Approx 0.09 gram

文件：613.51 Kbytes 页数：3 Pages

WEITRON

ZENER DIODES

POWER DISSIPATION: 500 mW FEATURES ◇ Glass sealed envelope ◇ High reliability ◇ Silicon epitaxial planer ◇ Constsnt voltage contral

文件：101.06 Kbytes 页数：3 Pages

BILIN

银河微电

Zener diode

Features 1. Low leakage 2. High reliability Applications Voltage stabilization

文件：139.92 Kbytes 页数：4 Pages

EXCELSEMI

优先半导体

ZENER DIODES

PD : 500 mW FEATURES : * High peak reverse power dissipation * High reliability * Low leakage current * Pb / RoHS Free MECHANICAL DATA Case: DO-34 Glass Case Weight: approx. 0.093g

文件：35.53 Kbytes 页数：2 Pages

SYNSEMI

ZENER DIODES

PD : 500 mW FEATURES : * High peak reverse power dissipation * High reliability * Low leakage current * Pb / RoHS Free MECHANICAL DATA Case: DO-34 Glass Case Weight: approx. 0.093g

文件：35.53 Kbytes 页数：2 Pages

SYNSEMI

Zener diode

Features 1. Low leakage 2. High reliability Applications Voltage stabilization

文件：139.92 Kbytes 页数：4 Pages

EXCELSEMI

优先半导体

ZENER DIODES

POWER DISSIPATION: 500 mW FEATURES ◇ Glass sealed envelope ◇ High reliability ◇ Silicon epitaxial planer ◇ Constsnt voltage contral

文件：101.06 Kbytes 页数：3 Pages

BILIN

银河微电

500mW Hermetically Sealed Glass Zener Diodes

FEATURES - Zener voltage range : 2.0V to 39V - DO-34 package (JEDEC DO-204) - Through-hole device type mounting - Hermetically sealed glass - Compression bonded construction - All external surfaces are corrosion resistant and leads are readily solderable - RoHS compliant - Solder hot dip T

文件：126.07 Kbytes 页数：5 Pages

TSC

台湾半导体