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MPX2300D

PRESSURE SENSORS

Chip Pak High Volume Pressure Sensor for Disposable, Backside Pressure Applications Motorola has developed a low cost, high volume, miniature pressure sensor package which is ideal as a sub–module component or a disposable unit. The unique concept of the Chip Pak allows great flexibility in

文件:106.52 Kbytes 页数:4 Pages

Motorola

摩托罗拉

MPX2300DT1

Sensor

Quality and Reliability—Overview A Major Objective of the Production Cycle From rigid incoming inspection of piece parts and materials, to stringent outgoing quality verification, the Motorola assembly and process flow is encompassed by an elaborate system of test and inspection stations; station

文件:6.37544 Mbytes 页数:670 Pages

Motorola

摩托罗拉

MPX2300DT1

PRESSURE SENSORS

Chip Pak High Volume Pressure Sensor For Disposable, Backside Pressure Applications Motorola has developed a low cost, high volume, miniature pressure sensor package which is ideal as a sub–module component or a disposable unit. The unique concept of the Chip Pak allows great flexibility in sy

文件:74.86 Kbytes 页数:4 Pages

Motorola

摩托罗拉

MPX2300DT1

MPX2300DT1, 0 to 40 kPa, Differential Compensated Pressure Sensor

文件:106.78 Kbytes 页数:7 Pages

恩XP

恩XP

MPX2300DT1

High Volume Pressure Sensor For Disposable Applications

文件:100.61 Kbytes 页数:4 Pages

freescaleFreescale Semiconductor, Inc

飞思卡尔飞思卡尔半导体

MPX2300DT1

High Volume Pressure Sensor for Disposable Applications

文件:58.72 Kbytes 页数:5 Pages

freescaleFreescale Semiconductor, Inc

飞思卡尔飞思卡尔半导体

MPX2300DT1

High Volume Pressure Sensor for Disposable Applications

文件:63.49 Kbytes 页数:5 Pages

freescaleFreescale Semiconductor, Inc

飞思卡尔飞思卡尔半导体

MPX2300DT1

High Volume Pressure Sensor for Disposable Applications

文件:52.21 Kbytes 页数:6 Pages

freescaleFreescale Semiconductor, Inc

飞思卡尔飞思卡尔半导体

MPX2300DT1_10

High Volume Pressure Sensor for Disposable Applications

文件:63.49 Kbytes 页数:5 Pages

freescaleFreescale Semiconductor, Inc

飞思卡尔飞思卡尔半导体

MPX2300DT1_12

High Volume Pressure Sensor for Disposable Applications

文件:52.21 Kbytes 页数:6 Pages

freescaleFreescale Semiconductor, Inc

飞思卡尔飞思卡尔半导体

技术参数

  • 说明:

    板载压力传感器 PRES SEN COMP 300MMHG

  • 最大工作温度:

    + 40 C

  • 最小工作温度:

    + 15 C

  • 封装 / 箱体:

    Case 423A-03

  • 封装:

    Reel

  • 系列:

    MPX230xDT1

  • 商标:

    NXP / Freescale

  • 安装风格:

    Through Hole

  • 工作电源电流:

    1 mA

  • 工作电源电压:

    6 V

  • 工厂包装数量:

    1000

  • 电源电压-最大:

    10 V

  • 端口类型:

    No Port

  • 子类别:

    Sensors

  • 产品类型:

    Pressure Sensors

  • 工作压力:

    5.8 psi

  • 压力类型:

    Gauge

供应商型号品牌批号封装库存备注价格
恩XP
2021+
SIP4
8630
原厂渠道,公司原装现货
询价
Freescale
24+
PAK
3000
原装现货假一罚十
询价
FreescaleSemiconductor
24+
原厂原装
6000
进口原装正品假一赔十,货期7-10天
询价
恩XP
1706+
?
7500
只做原装进口,假一罚十
询价
FREESCALE
22+
CHIPPAK
2000
原装现货库存.价格优势
询价
MOT
25+
423A-02
2987
绝对全新原装现货供应!
询价
FREESCALE
25+23+
SIP4
33456
绝对原装正品全新进口深圳现货
询价
MOTOROLA/摩托罗拉
24+
CASE423A
237
现货供应
询价
Freesca
20+
SIP-4
65790
原装优势主营型号-可开原型号增税票
询价
FRS
24+
65230
询价
更多MPX2300D供应商 更新时间2025-11-24 17:02:00