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MPC8358ECZUADDGA

PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications

This document provides an overview of the MPC8360E/58E PowerQUICC II Pro processor revision 2.x TBGA features, including a block diagram showing the major functional components. This device is a cost-effective, highly integrated communications processor that addresses the needs of the networki

文件:1.20024 Mbytes 页数:102 Pages

恩XP

恩XP

MPC8358ECZUAGDEA

PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications

This document provides an overview of the MPC8360E/58E PowerQUICC II Pro processor revision 2.x TBGA features, including a block diagram showing the major functional components. This device is a cost-effective, highly integrated communications processor that addresses the needs of the networki

文件:1.20024 Mbytes 页数:102 Pages

恩XP

恩XP

MPC8358ECZUAGDGA

PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications

This document provides an overview of the MPC8360E/58E PowerQUICC II Pro processor revision 2.x TBGA features, including a block diagram showing the major functional components. This device is a cost-effective, highly integrated communications processor that addresses the needs of the networki

文件:1.20024 Mbytes 页数:102 Pages

恩XP

恩XP

MPC8358ECZUAGDHA

PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications

This document provides an overview of the MPC8360E/58E PowerQUICC II Pro processor revision 2.x TBGA features, including a block diagram showing the major functional components. This device is a cost-effective, highly integrated communications processor that addresses the needs of the networki

文件:1.20024 Mbytes 页数:102 Pages

恩XP

恩XP

MPC8358ECZUAGFGA

PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications

This document provides an overview of the MPC8360E/58E PowerQUICC II Pro processor revision 2.x TBGA features, including a block diagram showing the major functional components. This device is a cost-effective, highly integrated communications processor that addresses the needs of the networki

文件:1.20024 Mbytes 页数:102 Pages

恩XP

恩XP

MPC8358ECZUAGFHA

PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications

This document provides an overview of the MPC8360E/58E PowerQUICC II Pro processor revision 2.x TBGA features, including a block diagram showing the major functional components. This device is a cost-effective, highly integrated communications processor that addresses the needs of the networki

文件:1.20024 Mbytes 页数:102 Pages

恩XP

恩XP

MPC8358ECZUAJDGA

PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications

This document provides an overview of the MPC8360E/58E PowerQUICC II Pro processor revision 2.x TBGA features, including a block diagram showing the major functional components. This device is a cost-effective, highly integrated communications processor that addresses the needs of the networki

文件:1.20024 Mbytes 页数:102 Pages

恩XP

恩XP

MPC8358ECZUAJDHA

PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications

This document provides an overview of the MPC8360E/58E PowerQUICC II Pro processor revision 2.x TBGA features, including a block diagram showing the major functional components. This device is a cost-effective, highly integrated communications processor that addresses the needs of the networki

文件:1.20024 Mbytes 页数:102 Pages

恩XP

恩XP

MPC8358ECZUAJFGA

PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications

This document provides an overview of the MPC8360E/58E PowerQUICC II Pro processor revision 2.x TBGA features, including a block diagram showing the major functional components. This device is a cost-effective, highly integrated communications processor that addresses the needs of the networki

文件:1.20024 Mbytes 页数:102 Pages

恩XP

恩XP

MPC8358ECZUAJFHA

PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications

This document provides an overview of the MPC8360E/58E PowerQUICC II Pro processor revision 2.x TBGA features, including a block diagram showing the major functional components. This device is a cost-effective, highly integrated communications processor that addresses the needs of the networki

文件:1.20024 Mbytes 页数:102 Pages

恩XP

恩XP

技术参数

  • 核数/总线宽度:

    1 코어,32 位

  • 速度:

    266MHz

  • 协处理器/DSP:

    通信;QUICC 引擎,安全;SEC

  • RAM 控制器:

    DDR,DDR2

  • 图形加速:

  • 以太网:

    10/100/1000 Mbps(1)

  • USB:

    USB 1.x (1)

  • 电压 - I/O:

    1.8V,2.5V,3.3V

  • 工作温度:

    -40°C ~ 105°C(TA)

  • 安全特性:

    密码技术,随机数发生器

  • 封装/外壳:

    740-LBGA

  • 供应商器件封装:

    740-TBGA(37.5x37.5)

  • 附加接口:

    DUART,HDLC,I²C,PCI,SPI,UART

供应商型号品牌批号封装库存备注价格
FREESCA
25+
BGA
29
百分百原装正品 真实公司现货库存 本公司只做原装 可
询价
FREESCA
16+
BGA
2500
进口原装现货/价格优势!
询价
Freescale
24+
668-PBGA
108
原装现货假一罚十
询价
FREESCALE
2016+
BGA
2500
只做原装,假一罚十,公司可开17%增值税发票!
询价
FREESCAL
BGA
264
正品原装--自家现货-实单可谈
询价
FREESCALE
24+
BGA
5000
全现原装公司现货
询价
FREESCALE
22+
TBGA74037.53
2000
原装现货库存.价格优势
询价
FREESCA
23+
BGA740P
8560
受权代理!全新原装现货特价热卖!
询价
FREESCAL
23+
BGAQFP
8659
原装公司现货!原装正品价格优势.
询价
FREESCALE
25+23+
BGA
37011
绝对原装正品全新进口深圳现货
询价
更多MPC8358供应商 更新时间2025-12-24 13:58:00