ZENER DIODES

FEATURES • PLANAR DIE CONSTRUCTION • ULTRA-SMALL SURFACE MOUNT PACKAGE • GENERAL PURPOSE, MEDIUM CURRENT • IDEALLY SUITED FOR AUTOMATED ASSEMBLY PROCESSES

文件：146.91 Kbytes 页数：2 Pages

FRONTIER

ZENER DIODE

ZENER DIODE FEATURES • Planar Die Construction • Ultra-Small Surface Mount Package • General purpose, Medium Current • Ideally Suited for Automated Assembly Processes

文件：1.04724 Mbytes 页数：5 Pages

JIANGSU

长电科技

Surface Mount Zener Diodes

Features • 500mW Power Dissipation • Planar Die Construction • General Purpose, Medium Current

文件：47.56 Kbytes 页数：2 Pages

KEXIN

科信电子

SURFACE MOUNT ZENER TYPE

FEATURES • Up to 500mW power dissipation. • Silicon epitaxial planar chip structure. • Wide zener reverse voltage range 2.4V to 75V. • Very tiny package size for high density applications. • Ideally suited for automated assembly processes. • Lead-free parts meet environmental sta

文件：197.71 Kbytes 页数：4 Pages

PACELEADER

霈峰

SURFACE MOUNT SILICON ZENER DIODES

FEATURES • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes • In compliance with EU RoHS 2002/95/EC directives

文件：82.37 Kbytes 页数：5 Pages

PANJIT

強茂

Surface Mount Zener Diode

Features • RoHS Compliant • Planar Die Construction • General Purpose Dissipation • Ideally suited for Automated Assembly Process

文件：225.05 Kbytes 页数：3 Pages

SECOS

喜可士

500mW, SOD-123 Series Surface Mount Zener Diodes

FEATURES • Planar die construction • 500Mw power dissipation • General purpose and medium current • Ideally suited for automated assembly processes APPLICATIONS • Zener diode • Ultra small surface mount package

文件：465.62 Kbytes 页数：3 Pages

SECOS

喜可士

Zener Diode

FEATURES ■ Planar Die Construction ■ Ultra-Small Surface Mount Package ■ General purpose, Medium Current ■ Ideally Suited for Automated Assembly Processes ■ SOD-123 Plastic-Encapsulate

文件：125.67 Kbytes 页数：3 Pages

SSC

Silicon Standard Corp.

丝印：WM；Package：SOD-123；SILICON PLANAR ZENER DIODES

Features • Total power dissipation: Max. 500 mW • Small plastic package suitable for surface mounted design • Tolerance approximately ± 5%

文件：962.46 Kbytes 页数：5 Pages

SY

顺烨电子

ZENER DIODES

VZ : 2.4 to 110 V PD : 500 mW FEATURES : * Total Power Dissipation 500 mW on FR-4 or FR-5 Board * Wide Zener Reverse Voltage Range 2.4 V to 110 V * Package Designed for Optimal Automated Board Assembly * Small Package Size for High Density Applications * General Purpose,Medi

文件：165.41 Kbytes 页数：2 Pages

SYNSEMI