500 mW Zener Diodes 2.4 to 39 Volts

Features • Lead Free Finish/RoHS Compliant(P Suffix designates RoHS Compliant. See ordering information) • Planar Die construction • Zener Voltages from 2.4V - 47V and 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes • ESD Rating of 16kV per Human Body Model

文件：411.99 Kbytes 页数：4 Pages

MCC

Surface Mount Zener Diodes

Features: *500mw Power Dissipation *Ideal for Surface Mountted Application *Zener Breakdown Voltage Range 2.4V to 110V

文件：244.75 Kbytes 页数：5 Pages

WEITRON

Surface mount zener diode

FEATURES • Planar die construction. • 500mW power dissipation. • General purpose, medium current. • Ideally suited for automated assembly processes. APPLICATIONS • Zener diode. • Ultra-small surface mount package.

文件：142.36 Kbytes 页数：4 Pages

BILIN

银河微电

500mW SURFACE MOUNT ZENER DIODES

FEATURES * Planar Die construction * 500mW Power Dissipation * Ideally Suited for Automated Assembly Processes

文件：734.06 Kbytes 页数：4 Pages

CHENG-YI

辰頤电子

SURFACE MOUNT ZENER DIODE

Features • Planar Die Construction • 500mW Power Dissipation on Ceramic PCB • General Purpose, Medium Current • Ideally Suited for Automated Assembly Processes

文件：889.1 Kbytes 页数：3 Pages

DIOTECH

SMD Zener Diode

500mW Surface Mount Zener Diodes - 2.4V-75V Features • Up to 500mW power dissipation. • Silicon epitaxial planar chip structure. • Wide Zener Voltage Range Selection, 2.4V to 75V. • 5 tolerance of Zener voltage for suffix B ex: ΜΜSΖ5221Β • Small Package Size for High Density

文件：77.2 Kbytes 页数：9 Pages

FORMOSA

美丽微半导体

ZENER DIODES

FEATURES • PLANAR DIE CONSTRUCTION • ULTRA-SMALL SURFACE MOUNT PACKAGE • GENERAL PURPOSE, MEDIUM CURRENT • IDEALLY SUITED FOR AUTOMATED ASSEMBLY PROCESSES

文件：146.91 Kbytes 页数：2 Pages

FRONTIER

ZENER DIODE

ZENER DIODE FEATURES • Planar Die Construction • Ultra-Small Surface Mount Package • General purpose, Medium Current • Ideally Suited for Automated Assembly Processes

文件：1.04724 Mbytes 页数：5 Pages

JIANGSU

长电科技

Surface Mount Zener Diodes

Features • 500mW Power Dissipation • Planar Die Construction • General Purpose, Medium Current

文件：47.56 Kbytes 页数：2 Pages

KEXIN

科信电子

SURFACE MOUNT ZENER TYPE

FEATURES • Up to 500mW power dissipation. • Silicon epitaxial planar chip structure. • Wide zener reverse voltage range 2.4V to 75V. • Very tiny package size for high density applications. • Ideally suited for automated assembly processes. • Lead-free parts meet environmental sta

文件：197.71 Kbytes 页数：4 Pages

PACELEADER

霈峰