500mW, SOD-123 Series Surface Mount Zener Diodes

FEATURES • Planar die construction • 500Mw power dissipation • General purpose and medium current • Ideally suited for automated assembly processes APPLICATIONS • Zener diode • Ultra small surface mount package

文件：465.62 Kbytes 页数：3 Pages

SECOS

喜可士

Zener Diode

FEATURES ■ Planar Die Construction ■ Ultra-Small Surface Mount Package ■ General purpose, Medium Current ■ Ideally Suited for Automated Assembly Processes ■ SOD-123 Plastic-Encapsulate

文件：125.67 Kbytes 页数：3 Pages

SSC

Silicon Standard Corp.

ZENER DIODES

VZ : 2.4 to 110 V PD : 500 mW FEATURES : * Total Power Dissipation 500 mW on FR-4 or FR-5 Board * Wide Zener Reverse Voltage Range 2.4 V to 110 V * Package Designed for Optimal Automated Board Assembly * Small Package Size for High Density Applications * General Purpose,Medi

文件：165.41 Kbytes 页数：2 Pages

SYNSEMI

500mW Two Terminals SMD Zener Diodes

Features • Silicon Planar Zener Construction • 500mW Power Dissipation • Zener Voltage 3.0v to 75v • Standard Zener Voltage Tolerance is ±5 with a “B” suffix • Ideal Suited for Automated Assembly Processes • RoHS Compliance

文件：203.27 Kbytes 页数：6 Pages

TAITRON

丝印：E3；Package：SOD-123；500mW SURFACE MOUNT ZENER DIODE

Planar Die Construction 500mW Power Dissipation 2.4V – 51V Nominal Zener Voltage 5 Standard Vz Tolerance Designed for Surface Mount Application Plastic Material – UL Recognition Flammability Classification 94V-0

文件：59.62 Kbytes 页数：5 Pages

WTE

Won-Top Electronics

500mW Surface Mount Zener Diode

FEATURES • Planar die construction. • 500mW power dissipation. • General purpose, medium current. • Ideally suited for automated assembly processes. APPLICATIONS • Zener diode. • Ultra-small surface mount package.

文件：197.15 Kbytes 页数：3 Pages

LUGUANG

鲁光电子

Planar Die Construction

FEATURES • Planar Die Construction • Ultra-Small Surface Mount Package • General purpose, Medium Current • Ideally Suited for Automated Assembly Processes

文件：130.88 Kbytes 页数：3 Pages

WINNERJOIN

永而佳

Surface mount zener diode

FEATURES • Planar die construction. • 500mW power dissipation. • General purpose, medium current. • Ideally suited for automated assembly processes. APPLICATIONS • Zener diode. • Ultra-small surface mount package.

文件：1.01169 Mbytes 页数：4 Pages

CHENDA

辰达半导体

Surface mount zener diode

FEATURES • Planar die construction. • 500mW power dissipation. • General purpose, medium current. • Ideally suited for automated assembly processes. APPLICATIONS • Zener diode. • Ultra-small surface mount package.

文件：257.54 Kbytes 页数：4 Pages

DSK

丝印：E3；Package：SOD-123；SOD-123 Plastic-Encapsulate Zener Diodes

Features Planar Die Construction Ultra-Small Surface Mount Package General purpose, Medium Current 350mW Power Dissipation On Ceramic PBC Ideally Suited for Automated Assembly Processes

文件：2.90923 Mbytes 页数：6 Pages

UNSEMI

优恩半导体