Surface mount zener diode

FEATURES • Planar die construction. • 500mW power dissipation. • General purpose, medium current. • Ideally suited for automated assembly processes. APPLICATIONS • Zener diode. • Ultra-small surface mount package.

文件：142.36 Kbytes 页数：4 Pages

BILIN

银河微电

500mW SURFACE MOUNT ZENER DIODES

FEATURES * Planar Die construction * 500mW Power Dissipation * Ideally Suited for Automated Assembly Processes

文件：734.06 Kbytes 页数：4 Pages

CHENG-YI

辰頤电子

ZENER DIODE

ZENER DIODE FEATURES • Planar Die Construction • Ultra-Small Surface Mount Package • General purpose, Medium Current • Ideally Suited for Automated Assembly Processes

文件：1.04724 Mbytes 页数：5 Pages

JIANGSU

长电科技

Surface Mount Zener Diodes

Features • 500mW Power Dissipation • Planar Die Construction • General Purpose, Medium Current

文件：47.56 Kbytes 页数：2 Pages

KEXIN

科信电子

SURFACE MOUNT ZENER TYPE

FEATURES • Up to 500mW power dissipation. • Silicon epitaxial planar chip structure. • Wide zener reverse voltage range 2.4V to 75V. • Very tiny package size for high density applications. • Ideally suited for automated assembly processes. • Lead-free parts meet environmental sta

文件：197.71 Kbytes 页数：4 Pages

PACELEADER

霈峰

500mW SURFACE MOUNT ZENER DIODE

500mW SURFACE MOUNT ZENER DIODE Features Planar Die Construction 500mW Power Dissipation 2.4 – 51V Nominal Zener Voltage 5 Standard Vz Tolerance Designed for Surface Mount Application Plastic Material – UL Recognition Flammability Classification 94V-O

文件：75.26 Kbytes 页数：4 Pages

WTE

Won-Top Electronics

丝印：D1；Package：SOD-123；500mW SURFACE MOUNT ZENER DIODE

Planar Die Construction 500mW Power Dissipation 2.4V – 51V Nominal Zener Voltage 5% Standard Vz Tolerance Designed for Surface Mount Application Plastic Material – UL Recognition Flammability Classification 94V-0

文件：59.62 Kbytes 页数：5 Pages

WTE

Won-Top Electronics

500mW Surface Mount Zener Diode

FEATURES • Planar die construction. • 500mW power dissipation. • General purpose, medium current. • Ideally suited for automated assembly processes. APPLICATIONS • Zener diode. • Ultra-small surface mount package.

文件：197.15 Kbytes 页数：3 Pages

LUGUANG

鲁光电子

Planar Die Construction

FEATURES • Planar Die Construction • Ultra-Small Surface Mount Package • General purpose, Medium Current • Ideally Suited for Automated Assembly Processes

文件：130.88 Kbytes 页数：3 Pages

WINNERJOIN

永而佳

Surface mount zener diode

FEATURES • Planar die construction. • 500mW power dissipation. • General purpose, medium current. • Ideally suited for automated assembly processes. APPLICATIONS • Zener diode. • Ultra-small surface mount package.

文件：1.01169 Mbytes 页数：4 Pages

CHENDA

辰达半导体