Surface Mount Zener Diodes

Surface Mount Zener Diodes Features: * 225mw Power Dissipation * Ideal for Surface Mountted Application * Case : SOT-23 Molded plastic Mechanical Data: * Zener Breakdown Voltage Range 2.4V to 91V * Terminals: Solderable per MIL-STD-202, Method 208 * Polarity: Cathode Indicated by Polarity

文件：268.14 Kbytes 页数：5 Pages

WEITRON

SILICON PLANAR ZENER DIODES

文件：523.669 Kbytes 页数：3 Pages

HTSEMI

金誉半导体

ZENER DIODE

FEATURES • Planar Die Construction • General 3urpose, Medium Current • Ideally Suited for Automated Assembly

文件：1.05675 Mbytes 页数：5 Pages

JIANGSU

长电科技

Surface Mount Zener Voltage Regulator Diodes

FEATURES ● Planar Die Construction ● 300 mW Power Dissipation on FR-4 PCB ● General Purpose, Medium Current ● Ideally Suited for Automated Assembly Process

文件：196.72 Kbytes 页数：4 Pages

SECOS

喜可士

丝印：AK；Package：SOT-23；SILICON PLANAR ZENER DIODES

Low Voltage General Purpose Voltage Regulator Diodes

文件：313.15 Kbytes 页数：3 Pages

SEMTECH_ELEC

先之科半导体

丝印：KE3；Package：SOT-23；SOT-23 Plastic-Encapsulate Diode

ZENER DIODE FEATURES： Planar Die Construction 350mW Power Dissipation on FR-4 PCB General purpose, Medium Current Ideally Suited for Automated Assembly

文件：267.81 Kbytes 页数：3 Pages

SY

顺烨电子

350mW Surface Mount Zener Diodes

Features • Planar Die construction • 350mW Power Dissipation • Standard Zener Voltage Tolerance is ± 5 • Ideally Suited for Automated Assembly Processes • High temperature soldering guaranteed: 260 °C / 10 seconds in reflow soldering process • RoHS compliant

文件：192.71 Kbytes 页数：5 Pages

TAITRON

丝印：E3；Package：SOT-23；350mW SURFACE MOUNT ZENER DIODE

Planar Die Construction 350mW Power Dissipation 2.4V – 51V Nominal Zener Voltage 5 Standard Vz Tolerance Designed for Surface Mount Application Plastic Material – UL Recognition Flammability Classification 94V-0

文件：60.72 Kbytes 页数：5 Pages

WTE

Won-Top Electronics

SOT-23 Plastic-Encapsulate Diode

FEATURES： • Planar Die Construction • 350mW Power Dissipation on FR-4 PCB • General purpose, Medium Current • Ideally Suited for Automated Assembly

文件：137.28 Kbytes 页数：2 Pages

WINNERJOIN

永而佳

丝印：KE3；Package：SOT-23；Planar Die Construction

FEATURES • Planar Die construction • 350mW Power Dissipation on FR-4 PCB • General Purpose, Medium Current • Ideally Suited for Automated Assembly Processes

文件：856.69 Kbytes 页数：3 Pages

SKTECHNOLGYSHIKE Electronics

时科广东时科微实业有限公司