Multilayer suppressors EMI-suppression products

Main applications areas for multilayer suppressors are: • computer and peripheral equipment: mother board, notebook, CD-Rom, DVD-Rom, CD-RW, scanner, hard disc, VGA card, sound card, LCD monitor, printer, PC server thumb drive, PCMCIA card, graphic card, etc. • network: LAN card, hub, switcher,

文件：168.57 Kbytes 页数：13 Pages

FERROXCUBE

System Power IC

2. Application SSD (Solid State Drive), portable devices, etc. 3. Features  Power supply voltage (VIN): 2.9 V to 5.5 V (PVIN1 to 6): 2.9 V to 5.5 V (LDO1_IN): 2.9 V to 5.5 V  IC operation condition setting when the power supply voltage is set to 3.3 V/5.0 V by MODE_SEL pin.  6 CH DC-DC

文件：1.10209 Mbytes 页数：48 Pages

TOSHIBA

东芝

Cost and Size Optimized PMIC for SAMA5DX/SAM9X6/SAMA7G Series MPUs

Applications • High-Performance MPUs Power Supply Solutions • μC/μP, FPGA and DSP Power

文件：1.69331 Mbytes 页数：44 Pages

MICROCHIP

微芯科技

System Power IC

2. Application SSD (Solid State Drive), portable devices, etc. 3. Features  Power supply voltage (VIN): 2.9 V to 5.5 V (PVIN1 to 6): 2.9 V to 5.5 V (LDO1_IN): 2.9 V to 5.5 V  IC operation condition setting when the power supply voltage is set to 3.3 V/5.0 V by MODE_SEL pin.  6 CH DC-DC

文件：1.10209 Mbytes 页数：48 Pages

TOSHIBA

东芝

2.4 GHz low pass filter matched to STM32WBxx in UFQFPN and VFQFPN

Features • Integrated impedance matching to to STM32WBxx in UFQFPN and VFQFPN packages • 50 Ω nominal impedance on antenna side • Deep rejection harmonics filter • Low insertion loss • Small footprint • Low profile ≤ 630 μm after reflow • High RF performances • RF BOM and area reduction

文件：767.26 Kbytes 页数：13 Pages

STMICROELECTRONICS

意法半导体

丝印：TX；Package：CSPG；2.4 GHz low pass filter matched to STM32WB5x and STM32WB1x in WLCSP and UFBGA packages

Features • Integrated impedance matching to STM32WB5x and STM32WB1x in WLCSP and UFBGA packages • 50 Ω nominal impedance on antenna side • Deep rejection harmonics filter • Low insertion loss • Small footprint • Low profile ≤ 630 μm after reflow • High RF performances • RF BOM and area re

文件：2.31802 Mbytes 页数：13 Pages

STMICROELECTRONICS

意法半导体

丝印：TS；Package：BumplessCSP；2.4 GHz low pass filter matched to STM32WB55Cx/Rx, STM32WB50Cx,STM32WB35Cx and STM32WB30Cx

Features • Integrated impedance matching to STM32WB55Cx/Rx, STM32WB50Cx, STM32WB35Cx and STM32WB30Cx • LGA footprint compatible • 50 Ω nominal impedance on antenna side • Deep rejection harmonics filter • Low insertion loss • Small footprint • Low thickness ≤ 450 μm • High RF performance

文件：574.07 Kbytes 页数：13 Pages

STMICROELECTRONICS

意法半导体

丝印：TT；Package：CSP-Bumpless；2.4 GHz low pass filter matched to STM32WB55Vx

Description The MLPF-WB55-02E3 integrates an impedance matching network and harmonics filter. The matching impedance network has been tailored to maximize the RF performance of STM32WB55Vx. This device uses STMicroelectronics IPD technology on non-conductive glass substrate which optimizes RF

文件：995.3 Kbytes 页数：13 Pages

STMICROELECTRONICS

意法半导体

Type MLPS/MLPSR 105 °C FlatpackTM, Ultra Long Life, Aluminum Electrolytic

Highlights • Military-grade flat electrolytics, now optimized for 105 °C applications • Life tested to 10,000 hours @ 105 °C, Rated Vdc • High Vibration resistance up to 20g (HV Option) • High Reliability burn-in available (48 hrs @ Vr, 105 °C) • Welded seal resists “dry-out,” typical of conv

文件：522.12 Kbytes 页数：10 Pages

CDE

Type MLPS/MLPSR 105 °C FlatpackTM, Ultra Long Life, Aluminum Electrolytic

Highlights • Military-grade flat electrolytics, now optimized for 105 °C applications • Life tested to 10,000 hours @ 105 °C, Rated Vdc • High Vibration resistance up to 20g (HV Option) • High Reliability burn-in available (48 hrs @ Vr, 105 °C) • Welded seal resists “dry-out,” typical of conv

文件：522.12 Kbytes 页数：10 Pages

CDE