High Frequency Devices-GaAs High Frequency Devices Small Signal GaAs FET/HEMTs，InGaP HBT MGF3022AM

MITSUBISHI

三菱电机

4U Height CompactPCI® Enclosure for 3U Cards

Features ƒ Hosts up to eight 3U Eurocard boards ƒ CompactPCI® Legacy backplane ƒ Support RIO ƒ PICMG 2.11power supplies ƒ PICMG 2.0, PICMG2.11

文件：356.35 Kbytes 页数：2 Pages

ADVANTECH

研华科技

3U CompactPCI® Intel® Quad-Core Atom™ Processor Blade

Features ƒ Supports Intel® Atom™ Processor E3826/E3827/E3845 ƒ Supports up to 4GB DDR3L-1333 soldered ECC memory ƒ Optional extension module on 8HP and RIO for VGA, LAN, USB, PS/2, Audio, COM ports ƒ Supports fanless application with optimized heatsink design ƒ Designed to meet EN50121-4 and

文件：790.48 Kbytes 页数：2 Pages

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研华科技

3U CompactPCI Intel® 6th Gen. Quad- Core™ Processor Blade

Features ƒ Intel® 6th Gen 14nm Xeon®/Core™ processor with CM236 PCH ƒ 8G or 16GB DDR4-2133 soldered memory with ECC or Non-ECC ƒ Multi-option storage as 2.5 SATA, 2280 M.2, Cfast, Mirco SD, etc ƒ 2 RJ45 GbE LAN, 2 USB3.0, 1VGA on front 4HP panel ƒ 1 RJ45 COM, 1 HDMI, 1 USB3.0, 2 M12 X-Coding

文件：1.22343 Mbytes 页数：3 Pages

ADVANTECH

研华科技