MDP1645E04

Thick Film Resistor Networks, Dual-In-Line, Molded DIP

FEATURES •0.190[4.83mm]maximumseatedheight •Rugged,moldedcaseconstruction •Lowtemperaturecoefficient(-55°Cto+125°C),   MDP1645:±100ppm/°C,MDP1646:±250ppm/°C •Compatiblewithautomaticinsertionequipment •Highlystablethickfilm •ReducesPCboardspaceandreduc

MDP1645E04

Thick Film Resistor Networks, Dual-In-Line, Molded DIP

MDP1645E04

Thick Film Resistor Networks, Dual-In-Line, Molded DIP

MDP1645E04122

Thick Film Resistor Networks, Dual-In-Line, Molded DIP; 0.190\" [4.83 mm] maximum seated height\nRugged, molded case construction\nLow temperature coefficient (- 55 ?C to + 125 ?C), MDP 1645: ± 100 ppm/?C, MDP 1646: ± 250 ppm/?C;