Thick Film Resistor Networks, Dual-In-Line, Molded DIP

FEATURES • 0.190 [4.83mm] maximum seated height • Rugged, molded case construction • Low temperature coefficient (- 55°C to + 125°C),    MDP 1645: ± 100ppm/°C, MDP 1646: ± 250ppm/°C • Compatible with automatic insertion equipment • Highly stable thick film • Reduces PC board space and reduc

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VishayVishay Siliconix

威世科技

Thick Film Resistor Networks, Dual-In-Line, Molded DIP

文件：276.8 Kbytes 页数：3 Pages

VishayVishay Siliconix

威世科技

Thick Film Resistor Networks, Dual-In-Line, Molded DIP

文件：97.83 Kbytes 页数：3 Pages

VishayVishay Siliconix

威世科技

Thick Film Resistor Networks, Dual-In-Line, Molded DIP

0.190\" [4.83 mm] maximum seated height\nRugged, molded case construction\nLow temperature coefficient (- 55 ?C to + 125 ?C), MDP 1645: ± 100 ppm/?C, MDP 1646: ± 250 ppm/?C;

Vishay

威世科技