Ferrite Chip Bead(Lead Free)

文件：85.63 Kbytes 页数：2 Pages

TAI-TECH

台庆科技

丝印：MB210；Package：SMB；Surface Mount Schottky Barrier Rectifier

Features  Plastic package has Underwriters Laboratory Flammability Classification 94V-O  For surface mounted applications in order to optimize board space  Low power loss,high efficiency  High surge capacity  Acquire quality system certificate : TS16949  AEC-Q101 qualified  Lead fr

文件：472.47 Kbytes 页数：5 Pages

PANJIT

強茂

丝印：MB210F；2Amp Surface Mount Bridge Rectifiers

文件：293.97 Kbytes 页数：2 Pages

SECOS

喜可士

丝印：MB210F；Package：MBF；2A SURFACE MOUNT SCHOTTKY BRIDGE

文件：294.1 Kbytes 页数：3 Pages

SKTECHNOLGYSHIKE Electronics

时科广东时科微实业有限公司

SURFACE MOUNT SCHOTTKY BARRIER RECTIFIER

Reverse Voltage - 40 to 200 Volts Forward Current - 2.0 Amperes FEATURES • Plastic package has Underwriters Laboratory Flammability Classification 94V-O • For surface mounted applications • Low profile package • Built-in strain relief • Metal to silicon rectifier. majority carrier conduc

文件：229.42 Kbytes 页数：2 Pages

SY

顺烨电子

Surface Mount Schottky Barrier Rectifier

Features  Plastic package has Underwriters Laboratory Flammability Classification 94V-O  For surface mounted applications in order to optimize board space  Low power loss,high efficiency  High surge capacity  Acquire quality system certificate : TS16949  AEC-Q101 qualified  Lead fr

文件：472.47 Kbytes 页数：5 Pages

PANJIT

強茂

2A SURFACE MOUNT SCHOTTKY BRIDGE

FEATURES: Reverse Voltage - 40 to 200 V Forward Current - 2 A High Surge Current Capability Designed for Surface Mount Application MECHANICAL DATA • Case: MBS • Terminals: Solderable per MIL-STD-750, Method 2026 • Approx. Weight: 100mg / 0.0035oz

文件：499.26 Kbytes 页数：3 Pages

YFWDIODE

佑风微

Surface Mount Schottky Bridge Rectifiers

REVERSE VOLTAGE: 20 - 100 V Features • High Temperature Soldering Guaranteed:260 °C/10 Second • Saves Space On Printed Circuit Board • RoHS compliant package

文件：346.2 Kbytes 页数：4 Pages

BWTECH

RECTIFIERS

FEATURES • Microminiature package. • Voidless hermetically sealed glass package. • Triple layer passivation. • Metallurgically bonded. • Ultra fast recovery • PIV to 215 volts. • Meet or exceed requirements of MIL-S-19500.

文件：46.22 Kbytes 页数：2 Pages

Microsemi

美高森美

CMOS SINGLE-CHIP 4-BIT MICROCOMPUTER WITH A/D CONVERTER

CMOS SINGLE-CHIP 4-BIT MICROCOMPUTER WITH A/D CONVERTER

文件：1.11625 Mbytes 页数：24 Pages

Fujitsu

富士通