包装：散装 类别：RF/IF，射频/中频和 RFID RF 配件 描述：ACCY MOUNT NMO 3/4IN

TE Connectivity Laird

Plug-In I&Q Modulator (50ohm 185 to 205 MHz)

文件：154.14 Kbytes 页数：1 Pages

MINI

The FlipStack® CSP family utilizes Amkor’s industry leading ChipArray® Ball Grid Array (CABGA) manufacturing capabilities

FEATURES Package height down to 0.6 mm Design, assembly and test capabilities that enable stacking combinations of memory, logic and mixed signal type devices Established package infrastructure with standard CABGA and fcCSP footprints Consistent product performance with high yields and rel

文件：728.44 Kbytes 页数：2 Pages

amkor

安靠科技

SOTM Transit Case System

文件：782.85 Kbytes 页数：2 Pages

Ultralife