Thin Film Attenuator Pads

MACOM attenuator chips are fabricated using our state of the art thin film metallization and advanced photolithography technology. All devices are available in chip form with a metalized ground connection on the back. This ground is wrapped around on the four corners of the chip so additional ground ·RoHS\n·DC to 40 GHz\n·Medium Power Handling 2W CW\n·Return Loss > 16 dB 13 to 40 GHz\n·Return Loss > 18 dB DC to 12 GHz\n·Flat Response From DC to 40 GHz\n·Very Good Stability Over Temperature (TCR < 100 PPM)\n·Space Saving Footprint .030” X .030” (762 X .762mm)\n·Ground Wrap to Top (No ground bond;

MACOM

Attenuator DIE

文件：460.03 Kbytes 页数：3 Pages

MA-COM

Package：模具；包装：卷带（TR）剪切带（CT）Digi-Reel® 得捷定制卷带 类别：RF/IF，射频/中频和 RFID 衰减器 描述：ATTENUATOR,DIE,30DB

MACOM Technology Solutions

Schottky Barrier Rectifiers

文件：131.35 Kbytes 页数：2 Pages

MOSPEC

统懋

SCHOTTKY BARRIER RECTIFIERS

FEATURES Plastic package has Underwriters Laboratory Flammability Classification 94V-0 Metal silicon junction ,majority carrier conduction Guard ring for overvoltage protection Low power loss ,high efficiency High current capability ,Low forward voltage drop High surge capability For use in

文件：1.60106 Mbytes 页数：3 Pages

SAMYANG

三阳电子

TO-220 Plastic-Encapsulate Diodes

文件：1.36241 Mbytes 页数：3 Pages

HDSEMI

海德半导体