Thin Film Attenuator Pads

MACOM attenuator chips are fabricated using our state of the art thin film metallization and advanced photolithography technology. All devices are available in chip form with a metalized ground connection on the back. This ground is wrapped around on the four corners of the chip so additional ground ·RoHS\n·DC to 40 GHz\n·Medium Power Handling 2W CW\n·Flat Response From DC to 40 GHz\n·Return Loss > 18 dB DC to 12 GHz\n·Return Loss > 16 dB 13 to 40 GHz\n·Space Saving Footprint .030” X .030” (762 X .762mm)\n·Very Good Stability Over Temperature (TCR < 100 PPM)\n·Ground Wrap to Top (No ground bond;

MACOM

Attenuator DIE

文件：460.03 Kbytes 页数：3 Pages

MA-COM

Package：模具；包装：卷带（TR）剪切带（CT）Digi-Reel® 得捷定制卷带 类别：RF/IF，射频/中频和 RFID 衰减器 描述：RF ATTENUATOR 2DB DIE

MACOM Technology Solutions

Eighth Brick Power Module Heat Sinks

文件：572.99 Kbytes 页数：9 Pages

LINEAGEPOWER

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文件：572.99 Kbytes 页数：9 Pages

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Silicon Photomultipliers (SiPM), Low-Noise, Blue-Sensitive

文件：1.61235 Mbytes 页数：16 Pages

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安森美半导体