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MADP-064908-131000

Unconnected Double Tee

DescriptionandApplications ThisdeviceisasiliconglassPINdiodechipfabricatedwithM/A-COMTechSolutionspatentedHMICprocess.This80μmI-regionlengthdevicefeaturessixsiliconpedestalsembeddedinalowloss,lowdispersionglass.Thediodesareformedonthetopofapedestaland

MA-COM

M/A-COM Technology Solutions, Inc.

MADP-064908-131000

Surface Mount Monolithic Integrated PIN Diode Chip

DescriptionandApplications ThisdeviceisaSilicon-GlassPINdiodechipfabricatedwithM/A-COM’spatentedHMICprocess.This8.0µmI-regionlengthdevicefeatures6siliconpedestalsembeddedinalowloss,lowdispersionglass.Thediodesareformedonthetopofapedestalandconnections

MACOMTyco Electronics

玛科姆技术方案控股有限公司

MADP-064908-131000

SURMOUNT PIN Diode Double Tee; ·No Wire Bonds Required\n·Better Performance than Packaged Devices\n·Higher RF C.W. Power Handling\n·Ultra-Low Parasitic Capacitance and Inductance\n·Polymer Scratch Protection\n·Silicon Nitride Passivation\n·Rugged Silicon-Glass Construction\n;

This device is a silicon glass PIN diode chip fabricated with MACOM‘s patented HMIC™ process. This 80µm I-region length device features six silicon pedestals embedded in a low loss, low dispersion glass. The diodes are formed on the top of a pedestal and connections to the backside of the device are facilitated by making the pedestal sidewalls electrically conductive. Selective backside metallization is applied producing a surface mount device. The topside is fully encapsulated with silicon nitride and has an additional polymer layer for scratch protection. These protective coatings prevent damage to the junction and the anode air-bridge during handling and assembly. The vertical silicon diode topology provides for a highly efficient heat transfer medium. These surface mount devices are suitable for usage in higher (3W avg.) incident power switches. Small parasitic inductance and excellent RC constant make these devices ideal for absorptive SPST, reflective SP2T switches, and attenuator circuits, where higher P1db and power handling values are required.

MACOMTyco Electronics

玛科姆技术方案控股有限公司

MADP-064908-131000

Unconnected Double Tee

MA-COM

M/A-COM Technology Solutions, Inc.

MADP-064908-131000_15

Surmount PIN Chip

MA-COM

M/A-COM Technology Solutions, Inc.

技术参数

  • Resistance(Ohm):

    5.00

  • Total Capacitance(pF):

    0.050

  • Lifetime(nS):

    200

  • CW Power Dissipation(W):

    1.0

  • Thermal Resistance(°C/W):

    150.0

  • Package:

    ODS-1310 die

  • Package Category:

    Surface Mount Die

  • Min Frequency(MHz):

    50

  • Max Frequency(MHz):

    18000

供应商型号品牌批号封装库存备注价格
MA-COM
19+
A/N
1000
进口原装现货
询价
10
优势库存,全新原装
询价
Macom
8000
询价
2017+
SMD
1585
只做原装正品假一赔十!
询价
QORVO
24+
SMD
5000
QORVO“芯达集团”专营品牌原装正品假一罚十
询价
POLYFET
19+
3128
原装进口假一罚十
询价
POLYFET
23+
NA
3128
原装正品代理渠道价格优势
询价
POLYFET
2021+
3128
十年专营原装现货,假一赔十
询价
POLYFET
NA
5500
一级代理 原装正品假一罚十价格优势长期供货
询价
POLYFET
25+
65248
百分百原装现货 实单必成
询价
更多MADP-064908-131000供应商 更新时间2025-7-30 10:48:00