Unconnected Double Tee

Description and Applications This device is a silicon glass PIN diode chip fabricated with M/A-COM Tech Solutions patented HMIC process. This 80μm I-region length device features six silicon pedestals embedded in a low loss, low dispersion glass. The diodes are formed on the top of a pedestal and

文件：156.65 Kbytes 页数：7 Pages

MA-COM

Surface Mount Monolithic Integrated PIN Diode Chip

Description and Applications This device is a Silicon-Glass PIN diode chip fabricated with M/A-COM’s patented HMIC process. This 8.0 µm I-region length device features 6 silicon pedestals embedded in a low loss, low dispersion glass. The diodes are formed on the top of a pedestal and connections

文件：511.08 Kbytes 页数：9 Pages

MACOM

Unconnected Double Tee

文件：156.65 Kbytes 页数：7 Pages

MA-COM

SURMOUNT PIN Diode Double Tee

This device is a silicon glass PIN diode chip fabricated with MACOM‘s patented HMIC™ process. This 80µm I-region length device features six silicon pedestals embedded in a low loss, low dispersion glass. The diodes are formed on the top of a pedestal and connections to the backside of the device are ·No Wire Bonds Required\n·Better Performance than Packaged Devices\n·Higher RF C.W. Power Handling\n·Ultra-Low Parasitic Capacitance and Inductance\n·Polymer Scratch Protection\n·Silicon Nitride Passivation\n·Rugged Silicon-Glass Construction;

MACOM

Surmount PIN Chip

文件：156.65 Kbytes 页数：7 Pages

MA-COM