Polymer Scratch Protection

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MA-COM

Surmount PIN Diode

This device is a silicon, glass PIN diode surmount chip fabricated with MACOM’s patented HMIC™ process. This device features two silicon pedestals embedded in a low loss, low dispersion glass. The diode is formed on the top of one pedestal and connections to the backside of the device are facilitate ·0603 Outline\n·High Average and Peak Power Handling\n·Low Parasitic Capacitance and Inductance\n·Polymer Scratch Protection\n·Silicon Nitride Passivation\n·No Wirebonds Required\n·15µm I-Region Length Devices\n·Surface Mount;

MACOM

Surmount PIN Diode

This device is a silicon, glass PIN diode surmount chip fabricated with MACOM’s patented HMIC™ process. This device features two silicon pedestals embedded in a low loss, low dispersion glass. The diode is formed on the top of one pedestal and connections to the backside of the device are facilitate ·0603 Outline\n·High Average and Peak Power Handling\n·Low Parasitic Capacitance and Inductance\n·Polymer Scratch Protection\n·Silicon Nitride Passivation\n·No Wirebonds Required\n·15µm I-Region Length Devices\n·Surface Mount;

MACOM

Package：2-SMD，无引线；包装：托盘 类别：分立半导体产品 二极管 - 射频 描述：RF DIODE PIN 115V

MACOM Technology Solutions

Package：0603（1608 公制）；包装：托盘 类别：分立半导体产品 二极管 - 射频 描述：DIODE,HMIC,PIN SURMOUNT

MACOM Technology Solutions