LZ52C12W

丝印：12；Package：1206；SURFACE MOUNT ZENER DIODE

FEATURES •Forsurfacemountedapplication •Siliconepitaxialplanardiode •Ultrasmallsurfacemountpackage •Lowleakagecurrent •2tolerancedeviceofVz •Lead-FreeFinish;RoHSCompliant(Notes1&2) •HalogenandAntimonyFree.“Green”Device(Note3)

AD-BZT52C12S

Plastic-EncapsulatedDiode

FEATURES ⚫Planardieconstruction ⚫200mWpowerdissipationonceramicPBC ⚫Generalpurpose,mediumcurrent ⚫AEC-Q101qualified

BZM52C12

0.5W12VZenerdiode

BZT52C12

500mWZenerDiode2.4to43Volts

BZT52C12

Surfacemountzenerdiode

FEATURES ●Planardieconstruction. ●500mWpowerdissipationonceramic PCB. ●Generalpurpose,mediumcurrent. ●Ideallysuitedforautomatedassemblyprocesses. APPLICATIONS ●Zenerdiode. ●Ultra-smallsurfacemountpackage.

BZT52C12

SurfaceMountZenerDiodes

Features ●PlanarDieConstruction ●500mWPowerDissipationonCeramicPCB ●GeneralPurpose,MediumCurrent

BZT52C12

410mWTwoTerminalsSMDZenerDiodes

410mWTwoTerminalsSMDZenerDiodes Features •PlanarDieConstruction •410mWPowerDissipation •ZenerVoltage2.4vto51v •RoHSCompliance

BZT52C12

410mWSURFACEMOUNTZENERDIODE

500mWSURFACEMOUNTZENERDIODE Features ●PlanarDieConstruction ●500mWPowerDissipation ●2.0V–51VNominalZenerVoltage ●5StandardVzTolerance ●DesignedforSurfaceMountApplication ●PlasticMaterial–ULRecognitionFlammability Classification94V-0

BZT52C12

410mWZenerDiodes2.4to39Volts

Features •PlanarDieConstruction •500mWPowerDissipationonCeramicPCB •GeneralPurposeMediumCurrent •IdeallySuitedforAutomatedAssemblyProcesses •EpoxymeetsUL94V-0flammabilityrating •MoistureSensitivityLevel1 •LeadFreeFinish/RoHSCompliant(PSuffixdesignatesRoH

BZT52C12

SurfacemountSiliconPlanarZenerDiodes