LX5543中文资料PDF规格书
LX5543规格书详情
DESCRIPTION
LX5543 is a WLAN front-end module (FEM) for 802.11b/g/n and other applications in the 2.4-2.5GHz frequency range. LX5543 integrates an advanced InGaP/GaAs Hetero-junction Bipolar Transistor (HBT) power amplifier with on chip impedance matching and a Depletion mode pHEMT (D-pHEMT) singlepole triple-throw (SP3T) switch in a single package with 3x3mm footprint. LX5543 provides capability of sharing a single antenna between WLAN and Bluetooth systems through the SP3T switch. 2.4-2.5GHz 802.11b/g/n FrontEnd Solution in a Single MLP
Package
KEY FEATURES
◾ SP3T for Sharing Antenna between WLAN and Bluetooth systems
◾ All RF I/O Matched to 50
◾ Single-Supply Voltage 3.0V to 4.2V
◾ Small Footprint: 3x3mm2
◾ Low Profile: 0.55mm
◾ RoHS Compliant & Pb-Free
TX Features :
◾ Power Gain ~ 25dB*
◾ Pout ~ +17dBm* for 3 EVM at Antenna
◾ Current ~145mA at +17dBm*
◾ Pout ~ +21dBm* for 11b 1Mbps DSSS Mask Compliance
◾ Quiescent Current ~ 82mA
RX Features :
◾ Insertion Loss ~ 0.6 dB
◾ IP1dB ~ +25 dBm
Bluetooth Path :
◾ Insertion Loss ~ 0.9 dB
◾ IP1dB ~ +29 dBm
* Including SP3T switch loss
APPLICATIONS
◾ IEEE 802.11b/g/n
◾ Mobile Phone WLAN module
供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
---|---|---|---|---|---|---|---|
Microchip |
23+ |
RF射频 |
11712 |
确保原装正品,一站式BOM配单 |
询价 | ||
MICROSEMI |
1733+ |
QFN |
6528 |
只做进口原装正品假一赔十! |
询价 | ||
Microsemi Corporation |
23+ |
9000 |
原装正品,支持实单 |
询价 | |||
MICROCHIP(美国微芯) |
23+ |
QFN12EP(2x2) |
3591 |
原装现货,免费供样,技术支持,原厂对接 |
询价 | ||
MICROCHIP(美国微芯) |
23+ |
QFN12EP(2x2) |
7350 |
现货供应,当天可交货!免费送样,原厂技术支持!!! |
询价 | ||
Microsemi |
MLPQ- 16L |
6000 |
原装现货,长期供应,终端可账期 |
询价 | |||
MICROCHIP-微芯 |
24+25+/26+27+ |
DFN-16 |
9328 |
一一有问必回一特殊渠道一有长期订货一备货HK仓库 |
询价 | ||
Microsemi |
24+ |
MLPG-12 |
5600 |
正常排单原厂正规渠道保证原装正品 |
询价 | ||
Microsemi/美高森美 |
1801+ |
16-MLPQ |
5960 |
原装正品-现货-绝对有货-实单价可谈 |
询价 | ||
Microsemi Corporation |
22+ |
9000 |
原厂渠道,现货配单 |
询价 |