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LX5543中文资料PDF规格书

LX5543
厂商型号

LX5543

功能描述

2.4-2.5 GHz Front-End Module with Internally Matched Power Amplifier and SP3T Switch

文件大小

92.93 Kbytes

页面数量

3

生产厂商 Microsemi Corporation
企业简称

Microsemi美高森美

中文名称

美高森美公司官网

原厂标识
数据手册

下载地址一下载地址二

更新时间

2024-6-18 17:11:00

LX5543规格书详情

DESCRIPTION

LX5543 is a WLAN front-end module (FEM) for 802.11b/g/n and other applications in the 2.4-2.5GHz frequency range. LX5543 integrates an advanced InGaP/GaAs Hetero-junction Bipolar Transistor (HBT) power amplifier with on chip impedance matching and a Depletion mode pHEMT (D-pHEMT) singlepole triple-throw (SP3T) switch in a single package with 3x3mm footprint. LX5543 provides capability of sharing a single antenna between WLAN and Bluetooth systems through the SP3T switch. 2.4-2.5GHz 802.11b/g/n FrontEnd Solution in a Single MLP

Package

KEY FEATURES

◾ SP3T for Sharing Antenna between WLAN and Bluetooth systems

◾ All RF I/O Matched to 50 

◾ Single-Supply Voltage 3.0V to 4.2V

◾ Small Footprint: 3x3mm2

◾ Low Profile: 0.55mm

◾ RoHS Compliant & Pb-Free

TX Features :

◾ Power Gain ~ 25dB*

◾ Pout ~ +17dBm* for 3 EVM at Antenna

◾ Current ~145mA at +17dBm*

◾ Pout ~ +21dBm* for 11b 1Mbps DSSS Mask Compliance

◾ Quiescent Current ~ 82mA

RX Features :

◾ Insertion Loss ~ 0.6 dB

◾ IP1dB ~ +25 dBm

Bluetooth Path :

◾ Insertion Loss ~ 0.9 dB

◾ IP1dB ~ +29 dBm

* Including SP3T switch loss

APPLICATIONS

◾ IEEE 802.11b/g/n

◾ Mobile Phone WLAN module

供应商 型号 品牌 批号 封装 库存 备注 价格
Microchip
23+
RF射频
11712
确保原装正品,一站式BOM配单
询价
MICROSEMI
1733+
QFN
6528
只做进口原装正品假一赔十!
询价
Microsemi Corporation
23+
9000
原装正品,支持实单
询价
MICROCHIP(美国微芯)
23+
QFN12EP(2x2)
3591
原装现货,免费供样,技术支持,原厂对接
询价
MICROCHIP(美国微芯)
23+
QFN12EP(2x2)
7350
现货供应,当天可交货!免费送样,原厂技术支持!!!
询价
Microsemi
MLPQ- 16L
6000
原装现货,长期供应,终端可账期
询价
MICROCHIP-微芯
24+25+/26+27+
DFN-16
9328
一一有问必回一特殊渠道一有长期订货一备货HK仓库
询价
Microsemi
24+
MLPG-12
5600
正常排单原厂正规渠道保证原装正品
询价
Microsemi/美高森美
1801+
16-MLPQ
5960
原装正品-现货-绝对有货-实单价可谈
询价
Microsemi Corporation
22+
9000
原厂渠道,现货配单
询价