LX5541LL中文资料WLAN Front End Modules (FEM)数据手册Microchip规格书

描述 Description

LX5541 is a co-package RFIC consisting of an InGaP/GaAs Heterojunction Bipolar Transistor (HBT) power amplifier, an InGaAs pseudomorphic HEMT (pHEMT) low noise amplifier, and a SPDT switch. All three RF devices are optimized for WLAN applications in the 2.3 to 2.5 GHz frequency range. The PA is implemented as a two-stage monolithic microwave integrated circuit (MMIC) with active bias and output pre-matching. The LNA is fully matched internally, and the LNA is connected to the RX port of SPDT switch directly inside the MLPQ package. Both PA and LNA operate with single low voltage supply of 3.3V. The PA (including SPDT switch loss) offers 27 dB power gain between 2.3-2.5GHz, at a low quiescent current of 90mA. For 19dBm OFDM output power (64QAM, 54Mbps) at the antenna port, the PA including SPDT switch provides a low EVM (Error-Vector Magnitude) of about 3%, and consumes 145 mA total DC current. The LNA (including SPDT switch loss) offers 13 dB gain, 2 dB noise figure (switch contribution included) and a high input IP3 of +5 dBm at 10 mA DC current. LX5541 is available in a low profile 16-pin 3mmx3mm micro-lead package (MLPQ-16L). LX5541 with a PA, LNA and SPDT integrated in a small, low profile, and low thermal resistance package offers an ideal compact front end solution for IEEE 802.11b/g/n applications.  ROHS, PB Free