LX Series Part-Sensing Light Screen

文件：746.77 Kbytes 页数：6 Pages

BANNER

邦纳电子

10.3 Gbps Coplanar GaAs PIN Photo Diode

KEY FEATURES LX3044 Single Die LX3045, 1x4 Array Die LX3046, 1x12 Array Die Coplanar Waveguide , 50ohm High Responsivity Low Dark Current High Bandwidth Anode/Cathode on Illuminated Side 125mm Pad pitch Die Good for Bond Wire or Flip Chip Applications APPLICATIONS Short

文件：727.05 Kbytes 页数：5 Pages

Microsemi

美高森美

10.3 Gbps Coplanar GaAs PIN Photo Diode

KEY FEATURES LX3044 Single Die LX3045, 1x4 Array Die LX3046, 1x12 Array Die Coplanar Waveguide , 50ohm High Responsivity Low Dark Current High Bandwidth Anode/Cathode on Illuminated Side 125mm Pad pitch Die Good for Bond Wire or Flip Chip Applications APPLICATIONS Short

文件：727.05 Kbytes 页数：5 Pages

Microsemi

美高森美

10.3 Gbps Coplanar GaAs PIN Photo Diode

KEY FEATURES LX3044 Single Die LX3045, 1x4 Array Die LX3046, 1x12 Array Die Coplanar Waveguide , 50ohm High Responsivity Low Dark Current High Bandwidth Anode/Cathode on Illuminated Side 125mm Pad pitch Die Good for Bond Wire or Flip Chip Applications APPLICATIONS Short

文件：727.05 Kbytes 页数：5 Pages

Microsemi

美高森美

10.3 Gbps Coplanar GaAs PIN Photo Diode

KEY FEATURES LX3044 Single Die LX3045, 1x4 Array Die LX3046, 1x12 Array Die Coplanar Waveguide , 50ohm High Responsivity Low Dark Current High Bandwidth Anode/Cathode on Illuminated Side 125mm Pad pitch Die Good for Bond Wire or Flip Chip Applications APPLICATIONS Short

文件：727.05 Kbytes 页数：5 Pages

Microsemi

美高森美

Coplanar InGaAs/InP PIN Photo Diode

KEY FEATURES LX3050 single die LX3052, 1x4 array die Coplanar Waveguide , 50ohm High Responsivity Low Dark Current High Bandwidth Anode/Cathode on illuminated side 125μm Pad pitch Die good for wire bond or flip-chip Die good for non-hermetic package APPLICATIONS 1310nm CATV Optical A

文件：600.98 Kbytes 页数：5 Pages

Microsemi

美高森美

Coplanar InGaAs/InP PIN Photo Diode

KEY FEATURES LX3051 single die Coplanar Waveguide , 50 ohm High Responsivity Low Dark Current High Bandwidth Anode/Cathode on illuminated side 125μm Pad pitch Die good for wire bond or flip-chip Die good for non-hermetic package APPLICATIONS 1310nm CATV Optical Applications SONET/SD

文件：608.06 Kbytes 页数：5 Pages

Microsemi

美高森美

Coplanar InGaAs/InP PIN Photo Diode

KEY FEATURES LX3050 single die LX3052, 1x4 array die Coplanar Waveguide , 50ohm High Responsivity Low Dark Current High Bandwidth Anode/Cathode on illuminated side 125μm Pad pitch Die good for wire bond or flip-chip Die good for non-hermetic package APPLICATIONS 1310nm CATV Optical A

文件：600.98 Kbytes 页数：5 Pages

Microsemi

美高森美

The LX3302 is the second member of Microsemi’s new family of smart sensor interface products

Key Features • Embedded 32-bit processing engine with 12 KB program memory • Two sensor input channels with integrated demodulator • Internal oscillator with frequency range of 1 to 5 MHz • Dual 13-bit ADC with sample rates to 2kHz • User-programmable 32 x 16-bit non-volatile configuration

文件：379.51 Kbytes 页数：2 Pages

Microsemi

美高森美

High Speed Inductive Positions Sensor with Diff erential Outputs

Product Features AEC-Q100 Grade 0 Certifi cation ISO26262 ASIL C(D) SEOOC Compliant Built-in Oscillator for Driving Primary Coil Two Independent Analog Channels With Demodulation Automatic Gain Control Maximizes Resolution over Large Target Air gaps Ranges 4.5V to 5.5V Input Range with Prote

文件：754.58 Kbytes 页数：6 Pages

Microchip

微芯科技