Ultra compact high performance e-compass 3D accelerometer and 3D magnetometer module

Description The LSM303DLHC is a system-in-package featuring a 3D digital linear acceleration sensor and a 3D digital magnetic sensor. LSM303DLHC has linear acceleration full-scales of ±2g / ±4g / ±8g / ±16g and a magnetic field full scale of ±1.3 / ±1.9 / ±2.5 / ±4.0 / ±4.7 / ±5.6 / ±8.1 gauss.

文件：579.06 Kbytes 页数：43 Pages

STMICROELECTRONICS

意法半导体

Ultra compact high performance e-compass 3D accelerometer and 3D magnetometer module

Description The LSM303DLHC is a system-in-package featuring a 3D digital linear acceleration sensor and a 3D digital magnetic sensor. LSM303DLHC has linear acceleration full-scales of ±2g / ±4g / ±8g / ±16g and a magnetic field full scale of ±1.3 / ±1.9 / ±2.5 / ±4.0 / ±4.7 / ±5.6 / ±8.1 gauss.

文件：619.47 Kbytes 页数：42 Pages

STMICROELECTRONICS

意法半导体

Ultra compact high performance e-compass 3D accelerometer and 3D magnetometer module

Description The LSM303DLHC is a system-in-package featuring a 3D digital linear acceleration sensor and a 3D digital magnetic sensor. LSM303DLHC has linear acceleration full-scales of ±2g / ±4g / ±8g / ±16g and a magnetic field full scale of ±1.3 / ±1.9 / ±2.5 / ±4.0 / ±4.7 / ±5.6 / ±8.1 gauss.

文件：619.47 Kbytes 页数：42 Pages

STMICROELECTRONICS

意法半导体

Sensor module: 3-axis accelerometer and 3-axis magnetometer

Description The LSM303DLH is a system-in-package featuring a 3D digital linear acceleration sensor and a 3D digital magnetic sensor. The various sensing elements are manufactured using specialized micromachining processes, while the IC interfaces are realized using a CMOS technology that allows t

文件：608.24 Kbytes 页数：47 Pages

STMICROELECTRONICS

意法半导体

Sensor module:3-axis accelerometer and 3-axis magnetometer

Description The LSM303DLM is a system-in-package featuring a 3D digital linear acceleration sensor and a 3D digital magnetic sensor. The various sensing elements are manufactured by using specialized micromachining processes, while the IC interfaces are realized using a CMOS technology that allo

文件：512.21 Kbytes 页数：38 Pages

STMICROELECTRONICS

意法半导体

Sensor module:3-axis accelerometer and 3-axis magnetometer

Description The LSM303DLM is a system-in-package featuring a 3D digital linear acceleration sensor and a 3D digital magnetic sensor. The various sensing elements are manufactured by using specialized micromachining processes, while the IC interfaces are realized using a CMOS technology that allo

文件：512.21 Kbytes 页数：38 Pages

STMICROELECTRONICS

意法半导体

3 AMP SCHOTTKY ORING RECTIFIER

3 Amp Schottky ORing Rectifier • Schottky Barrier Rectifier • Vf @ 3A, 100°C = 0.22V • 125°C Junction temperature • Reverse Energy Tested

文件：101.85 Kbytes 页数：2 Pages

MICROSEMI

美高森美

Linear sensor module 3D accelerometer sensor and 3D gyroscope sensor

Description The LSM330DL is a system-in-package featuring a 3D digital accelerometer and a 3D digital gyroscope. ST’s family of modules leverages a robust and mature manufacturing process already used for the production of micromachined accelerometers. The various sensing elements are manufactu

文件：1.07009 Mbytes 页数：54 Pages

STMICROELECTRONICS

意法半导体

iNEMO inertial module: 3D accelerometer and 3D gyroscope

Description The LSM330DLC is a system-in-package featuring a 3D digital accelerometer and a 3D digital gyroscope. ST’s family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers. The various sensing eleme

文件：1.46976 Mbytes 页数：66 Pages

STMICROELECTRONICS

意法半导体

iNEMO inertial module: 3D accelerometer and 3D gyroscope

Description The LSM330DLC is a system-in-package featuring a 3D digital accelerometer and a 3D digital gyroscope. ST’s family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers. The various sensing eleme

文件：1.46976 Mbytes 页数：66 Pages

STMICROELECTRONICS

意法半导体