MICRF219

300MHzto450MHzASKReceiverwithRSSI,Auto-Poll,Bit-CheckandSquelch

GENERALDESCRIPTION TheMICRF219isa300MHzto450MHzsuper-heterodyne,image-reject,RFreceiverwithAutomaticGainControl,OOK/ASKdemodulatorandanalogRSSIoutput.ThedeviceintegratesAuto-Poll,ValidBit-Check,Squelch,andDesensefeatures.Itonlyrequiresacrystalandaminimumof

MICRF219

300MHzto450MHzASKReceiverwithRSSI,Auto-Poll,Bit-Che

MICRF219A

ASK/OOKReceiver

GeneralDescription TheMICRF219Aisa300MHzto450MHzsuper-heterodyne,image-reject,RFreceiverwithautomaticgaincontrol,ASK/OOKdemodulator,andanalogRSSIoutput.Itonlyrequiresacrystalandaminimumnumberofexternalcomponentstoimplement.TheMICRF219Aisidealforlow-cost,l

MICRF219AAYQS

300MHzto450MHzASK/OOKReceiverwithAuto-Poll,andRSSI

MICRF219AAYQS

ASK/OOKReceiver

GeneralDescription TheMICRF219Aisa300MHzto450MHzsuper-heterodyne,image-reject,RFreceiverwithautomaticgaincontrol,ASK/OOKdemodulator,andanalogRSSIoutput.Itonlyrequiresacrystalandaminimumnumberofexternalcomponentstoimplement.TheMICRF219Aisidealforlow-cost,l

MICRF219AYQS

300MHzto450MHzASKReceiverwithRSSI,Auto-Poll,Bit-Che

MO-219

TheFlipStack®CSPfamilyutilizesAmkor’sindustryleadingChipArray®BallGridArray(CABGA)manufacturingcapabilities

FEATURES Packageheightdownto0.6mm Design,assemblyandtestcapabilitiesthatenablestackingcombinationsofmemory,logicandmixedsignaltypedevices EstablishedpackageinfrastructurewithstandardCABGAandfcCSPfootprints Consistentproductperformancewithhighyieldsandrel

MZ219

3WATTGLASSZENERDIODES

FEATURES ●Microminiaturepackage. ●Voidlesshermeticallysealedglasspackage. ●Triplelayerpassivation. ●Metallurgicallybonded. ●Highperformancecharacteristics. ●Stableoperationattemperatureto200°C ●Verylowthermalimpedance.

MZ219

3WATTZENERDIODES

3WATTZENERDIODES AvailableNon-RoHS(standard)orRoHScompliant(addPBFsuffix). Availableas“HR”(highreliability)screenedperMIL-PRF-19500,JANTXlevel.Add“HR”suffixtobasepartnumber.

NCSL219BT

SPECIFICATIONSFORWARMWHITELED