The FlipStack® CSP family utilizes Amkor’s industry leading ChipArray® Ball Grid Array (CABGA) manufacturing capabilities

FEATURES Package height down to 0.6 mm Design, assembly and test capabilities that enable stacking combinations of memory, logic and mixed signal type devices Established package infrastructure with standard CABGA and fcCSP footprints Consistent product performance with high yields and rel

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amkor

安靠科技

3 WATT GLASS ZENER DIODES

FEATURES ● Microminiature package. ● Voidless hermetically sealed glass package. ● Triple layer passivation. ● Metallurgically bonded. ● High performance characteristics. ● Stable operation at temperature to 200°C ● Very low thermal impedance.

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Microsemi

美高森美

3 WATT ZENER DIODES

3 WATT ZENER DIODES Available Non-RoHS (standard) or RoHS compliant (add PBF suffix). Available as “HR” (high reliability) screened per MIL-PRF-19500, JANTX level. Add “HR” suffix to base part number.

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DIGITRON

SPECIFICATIONS FOR WARM WHITE LED

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NICHIA

日亚