型号：MMBZ5231B；Package：SOT-23；SOT-23 Plastic-Encapsulate Diode

ZENER DIODE FEATURES： Planar Die Construction 350mW Power Dissipation on FR-4 PCB General purpose, Medium Current Ideally Suited for Automated Assembly

文件：267.81 Kbytes 页数：3 Pages

SY

顺烨电子

型号：MMBZ5231B；Package：SOT-23；Planar Die Construction

FEATURES • Planar Die construction • 350mW Power Dissipation on FR-4 PCB • General Purpose, Medium Current • Ideally Suited for Automated Assembly Processes

文件：856.69 Kbytes 页数：3 Pages

SKTECHNOLGYSHIKE Electronics

时科广东时科微实业有限公司

型号：MMBZ5231BW；Package：SOT-323；Planar Die Construction

FEATURES Planar Die Construction Ultra-Small Surface Mount Package General Purpose Ideally Suited for Automated Assembly Processes

文件：853.63 Kbytes 页数：3 Pages

SKTECHNOLGYSHIKE Electronics

时科广东时科微实业有限公司

型号：MMBZ5232BS；Package：SOT-363；Planar Die Construction

Features • Planar Die Construction • Dual Isolated Zeners in Ultra-Small Surface Mount Package • Ideally Suited for Automated Assembly Processes • Lead Free/RoHS Compliant (Note 5)

文件：856.07 Kbytes 页数：3 Pages

SKTECHNOLGYSHIKE Electronics

时科广东时科微实业有限公司

型号：KE12Z；Kinetis KE17Z/13Z/12Z with up to 512 KB Flash

•This document provides electrical specifications for Kinetis KE17Z/13Z/12Z with up to 512 KB Flash Data Sheet •For functional characteristics and the programming model, see Kinetis KE17Z/13Z/12Z with up to 512 KB Flash Reference Manual. 2.1 System features The following sections describe th

文件：1.69084 Mbytes 页数：86 Pages

恩XP

型号：KE13Z；Kinetis KE17Z/13Z/12Z with up to 512 KB Flash

•This document provides electrical specifications for Kinetis KE17Z/13Z/12Z with up to 512 KB Flash Data Sheet •For functional characteristics and the programming model, see Kinetis KE17Z/13Z/12Z with up to 512 KB Flash Reference Manual. 2.1 System features The following sections describe th

文件：1.69084 Mbytes 页数：86 Pages

恩XP

型号：KE17Z；Kinetis KE17Z/13Z/12Z with up to 512 KB Flash

•This document provides electrical specifications for Kinetis KE17Z/13Z/12Z with up to 512 KB Flash Data Sheet •For functional characteristics and the programming model, see Kinetis KE17Z/13Z/12Z with up to 512 KB Flash Reference Manual. 2.1 System features The following sections describe th

文件：1.69084 Mbytes 页数：86 Pages

恩XP

型号：KE1XFP100M168SF0；Kinetis KE1xF with up to 512 KB Flash Up to 168 MHz ARM짰 Cortex짰-M4 Based Microcontroller

The KE1xF microcontroller is built on the ARM® Cortex®-M4 processor with stronger performance and higher memory densities in multiple packages. This device offers up to 168 MHz performance with integrated single-precision floating point unit (FPU) and digital signal processor (DSP). Embedded f

文件：1.70448 Mbytes 页数：101 Pages

恩XP

型号：KE1XZP100M72SF1；Kinetis KE17Z/13Z/12Z with up to 256 KB Flash

KE1xZ256 MCUs are the leading parts for the KE1xZ family based on ARM® Cortex®-M0+ core. Providing up to 256 KB flash, up to 48 KB RAM, and the complete set of analog/digital features, KE1xZ extends Kinetis E family to higher performance and broader scalability. Robust and enhanced TSIs provid

文件：1.61382 Mbytes 页数：84 Pages

恩XP

型号：KE1XZP100M72SF1_V01；Kinetis KE17Z/13Z/12Z with up to 256 KB Flash

KE1xZ256 MCUs are the leading parts for the KE1xZ family based on ARM® Cortex®-M0+ core. Providing up to 256 KB flash, up to 48 KB RAM, and the complete set of analog/digital features, KE1xZ extends Kinetis E family to higher performance and broader scalability. Robust and enhanced TSIs provid

文件：1.61382 Mbytes 页数：84 Pages

恩XP