Small Signal Switching Transistor

Small Signal Switching Transistor NPN Silicon Features • MIL−PRF−19500/255 Qualified • Available as JAN, JANTX, and JANTXV

文件：90.9 Kbytes 页数：3 Pages

ONSEMI

安森美半导体

NPN SILICON SWITCHING TRANSISTOR

NPN SILICON SWITCHING TRANSISTOR Qualified per MIL-PRF-19500/255

文件：58.65 Kbytes 页数：2 Pages

MICROSEMI

美高森美

TECHNICAL DATA SHEET NPN SILICON SWITCHING TRANSISTOR

文件：142.92 Kbytes 页数：6 Pages

MICROSEMI

美高森美

NPN Silicon Switching 50V, 0.8A

This specification covers the performance requirements for NPN, silicon, switching 2N2221 and 2N2222 transistors. Four levels of product assurance (JAN, JANTX, JANTXV and JANS) are provided for each encapsulated device type as specified in MIL-PRF-19500/255 and two levels of product assurance (JANHC The device packages for the encapsulated device types are as follows: 2N2221A and 2N2222A (TO-18, UA, UB, UBC, UBN, and UBCN). \nThe dimensions and topography for JANHC and JANKC unencapsulated die are as outlined in MIL-PRF-19500/255.;

Microchip

微芯科技

Package：TO-206AA，TO-18-3 金属罐；包装：散装 类别：分立半导体产品 晶体管 - 双极性晶体管（BJT）- 单个 描述：TRANS NPN 50V 0.8A TO218

MICROCHIP

微芯科技

NPN Silicon Switching 50V, 0.8A

This specification covers the performance requirements for NPN, silicon, switching 2N2221 and 2N2222 transistors. Four levels of product assurance (JAN, JANTX, JANTXV and JANS) are provided for each encapsulated device type as specified in MIL-PRF-19500/255 and two levels of product assurance (JANHC The device packages for the encapsulated device types are as follows: 2N2221A and 2N2222A (TO-18, UA, UB, UBC, UBN, and UBCN). \nThe dimensions and topography for JANHC and JANKC unencapsulated die are as outlined in MIL-PRF-19500/255.;

Microchip

微芯科技

NPN Silicon Switching 50V, 0.8A

This specification covers the performance requirements for NPN, silicon, switching 2N2221 and 2N2222 transistors. Four levels of product assurance (JAN, JANTX, JANTXV and JANS) are provided for each encapsulated device type as specified in MIL-PRF-19500/255 and two levels of product assurance (JANHC The device packages for the encapsulated device types are as follows: 2N2221A and 2N2222A (TO-18, UA, UB, UBC, UBN, and UBCN). \nThe dimensions and topography for JANHC and JANKC unencapsulated die are as outlined in MIL-PRF-19500/255.;

Microchip

微芯科技

Package：TO-206AA，TO-18-3 金属罐；包装：卷带（TR） 类别：分立半导体产品 晶体管 - 双极性晶体管（BJT）- 单个 描述：SMALL-SIGNAL BJT

MICROCHIP

微芯科技

Package：4-SMD；包装：散装 类别：分立半导体产品 晶体管 - 双极性晶体管（BJT）- 单个 描述：TRANS NPN 50V 0.8A 4SMD

MICROCHIP

微芯科技