IRFE110中文资料IRF数据手册PDF规格书

REPETITIVE AVALANCHE AND dv/dt RATED

HEXFET® TRANSISTORS

SURFACE MOUNT (LCC-18)

The leadless chip carrier (LCC) package represents the logical next step in the continual evolution of surface mount technology. Desinged to be a close replacement for the TO-39 package, the LCC will give designers the extra flexibility they need to increase circuit board density. International Rectifier has engineered the LCC package to meet the specific needs of the power market by increasing the size of the bottom source pad, thereby enhancing the thermal and electrical performance. The lid of the package is grounded to the source to reduce RF interference.

Features:

■ Surface Mount

■ Small Footprint

■ Alternative to TO-39 Package

■ Hermetically Sealed

■ Dynamic dv/dt Rating

■ Avalanche Energy Rating

■ Simple Drive Requirements

■ Light Weight