Power MOSFET(Vdss=100V, Rds(on)=44mohm, Id=33A)

Advanced HEXFET®Power MOSFETs from International Rectifier utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET power MOSFETs are well known for, provides the de

文件：125.07 Kbytes 页数：10 Pages

IRF

Isc N-Channel MOSFET Transistor

• FEATURES • With To-263(D2PAK) package • Low input capacitance and gate charge • Low gate input resistance • 100 avalanche tested • Minimum Lot-to-Lot variations for robust device performance and reliable operation • APPLICATIONS • Switching applications

文件：188.81 Kbytes 页数：2 Pages

ISC

无锡固电

N-Channel MOSFET

■ Features ● VDS (V) = 100V ● ID = 33 A (VGS = 10V) ● RDS(ON)

文件：2.46446 Mbytes 页数：6 Pages

KEXIN

科信电子

Ultra Low On-Resistance

Description The D2Pak is a surface mount power package capable of accommodating die sizes up to HEX-4. It provides the highest power capability and the lowest possible on-resistance in any existing surface mount package. The D2Pak is suitable for high current applications because of its low inter

文件：1.0709 Mbytes 页数：10 Pages

KERSEMI

HEXFET짰 Power MOSFET

文件：274.28 Kbytes 页数：10 Pages

IRF

HEXFET짰 Power MOSFET

Description Advanced HEXFET® Power MOSFETs from International Rectifier utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET power MOSFETs are well known for, p

文件：284.02 Kbytes 页数：11 Pages

IRF

丝印：D2PAK；Package：TO-263；N-Channel 100-V (D-S) MOSFET

FEATURES • TrenchFET® Power MOSFETS • 175 °C Junction Temperature • Low Thermal Resistance Package

文件：1.84856 Mbytes 页数：8 Pages

VBSEMI

微碧半导体

HEXFET짰 Power MOSFET

文件：274.28 Kbytes 页数：10 Pages

IRF

Advanced Process Technology

文件：284.98 Kbytes 页数：11 Pages

IRF

Advanced Process Technology

文件：284.98 Kbytes 页数：11 Pages

IRF