IRF1104LPBF中文资料IRF数据手册PDF规格书

VDSS = 40V

RDS(on) = 0.009Ω

ID = 100A

Description

Fifth Generation HEXFETs from International Rectifier utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET Power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in a wide variety of applications. The D2Pak is a surface mount power package capable of accommodating die sizes up to HEX-4. It provides the highest power capability and the lowest possible on-resistance in any existing surface mount package. The D2Pak is

suitable for high current applications because of its low internal connection resistance and can dissipate up to 2.0W in a typical surface mount application. The through-hole version (IRF1104L) is available for low profile applications.

Advanced Process Technology

Ultra Low On-Resistance

Surface Mount (IRF1104S)

Low-profile through-hole (IRF1104L)

175°C Operating Temperature

Fast Switching

Fully Avalanche Rated

Lead-Free