GS816136D-225I

165 Bump BGA-x18 Commom I/O - Top View (Package D)

GS816136D-250

165 Bump BGA-x18 Commom I/O - Top View (Package D)

GS816136D-250I

165 Bump BGA-x18 Commom I/O - Top View (Package D)

GS816136DGD-150

SYNCBURST SRAMs; • Industry-standard Synchronous Burst Interface\n• ZQ mode pin for user-selectable high/low output drive\n• LBO pin for Linear or Interleaved Burst mode\n• Byte Write (BW) and/or Global Write (GW) operation\n• Internal self-timed write cycle\n• Automatic power-down for portable applications\n• JEDEC-standard pinout and package\n• RoHS-compliant package available\n;

GS816136DGD-333I

Package：165-LBGA；包装：托盘 类别：集成电路（IC） 存储器 描述：IC SRAM 18MBIT PARALLEL 165FPBGA

ETC