165 Bump BGA-x18 Commom I/O - Top View (Package D)

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165 Bump BGA-x18 Commom I/O - Top View (Package D)

文件：1.39188 Mbytes 页数：40 Pages

ETCList of Unclassifed Manufacturers

未分类制造商

165 Bump BGA-x18 Commom I/O - Top View (Package D)

文件：1.39188 Mbytes 页数：40 Pages

ETCList of Unclassifed Manufacturers

未分类制造商

SYNCBURST SRAMs

• Industry-standard Synchronous Burst Interface\n• LBO pin for Linear or Interleaved Burst mode\n• Internal self-timed write cycle\n• JEDEC-standard pinout and package\n• RoHS-compliant package available\n;

GSI

SYNCBURST SRAMs

• Industry-standard Synchronous Burst Interface\n• ZQ mode pin for user-selectable high/low output drive\n• LBO pin for Linear or Interleaved Burst mode\n• Byte Write (BW) and/or Global Write (GW) operation\n• Internal self-timed write cycle\n• Automatic power-down for portable applications\n• JEDEC;

GSI

SYNCBURST SRAMs

• Industry-standard Synchronous Burst Interface\n• ZQ mode pin for user-selectable high/low output drive\n• LBO pin for Linear or Interleaved Burst mode\n• Byte Write (BW) and/or Global Write (GW) operation\n• Internal self-timed write cycle\n• Automatic power-down for portable applications\n• JEDEC;

GSI