Switchmode Power Supply

GPP 10 Conforms to IEC 60950 Applications ■ Offi ce equipment ■ Data transmission devices ■ IT equipment ■ Measurement and weighing technology GPP 10 Medical Conforms to IEC 60950 Applications ■ Blood analyzer ■ Patient monitors ■ Measuring instruments ■ Laboratory equipment

文件：179.39 Kbytes 页数：2 Pages

FRIWO

GLASS PASSIVATED RECTIFIER

文件：131.76 Kbytes 页数：2 Pages

CHENG-YI

辰頤电子

Glass Passivated Junction Plastic Rectifier

FEATURES • Glass passivated chip junction • Low forward voltage drop • Low leakage current, typical IR less than 0.1 μA • High forward surge capability • Meets environmental standard MIL-S-19500 • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Material categorization: for definitions of co

文件：69.47 Kbytes 页数：4 Pages

VishayVishay Siliconix

威世威世科技公司

Glass Passivated Junction Plastic Rectifier

FEATURES • Glass passivated chip junction • Low forward voltage drop • Low leakage current, typical IR less than 0.1 μA • High forward surge capability • Meets environmental standard MIL-S-19500 • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Material categorization: for definitions of co

文件：69.47 Kbytes 页数：4 Pages

VishayVishay Siliconix

威世威世科技公司

Glass Passivated Junction Plastic Rectifier

FEATURES • Glass passivated chip junction • Low forward voltage drop • Low leakage current, typical IR less than 0.1 μA • High forward surge capability • Meets environmental standard MIL-S-19500 • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Material categorization: for definitions of co

文件：69.47 Kbytes 页数：4 Pages

VishayVishay Siliconix

威世威世科技公司

Glass Passivated Junction Plastic Rectifier

FEATURES • Glass passivated chip junction • Low forward voltage drop • Low leakage current, typical IR less than 0.1 μA • High forward surge capability • Meets environmental standard MIL-S-19500 • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Material categorization: for definitions of co

文件：69.47 Kbytes 页数：4 Pages

VishayVishay Siliconix

威世威世科技公司

Glass Passivated Junction Plastic Rectifier

FEATURES • Glass passivated chip junction • Low forward voltage drop • Low leakage current, typical IR less than 0.1 μA • High forward surge capability • Meets environmental standard MIL-S-19500 • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Material categorization: for definitions of co

文件：69.47 Kbytes 页数：4 Pages

VishayVishay Siliconix

威世威世科技公司

Glass Passivated Junction Plastic Rectifier

FEATURES • Glass passivated chip junction • Low forward voltage drop • Low leakage current, typical IR less than 0.1 μA • High forward surge capability • Meets environmental standard MIL-S-19500 • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Material categorization: for definitions of co

文件：69.47 Kbytes 页数：4 Pages

VishayVishay Siliconix

威世威世科技公司

Glass Passivated Junction Plastic Rectifier

FEATURES • Glass passivated chip junction • Low forward voltage drop • Low leakage current, typical IR less than 0.1 μA • High forward surge capability • Meets environmental standard MIL-S-19500 • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Material categorization: for definitions of co

文件：69.47 Kbytes 页数：4 Pages

VishayVishay Siliconix

威世威世科技公司

Glass Passivated Junction Plastic Rectifier

FEATURES • Glass passivated chip junction • Low forward voltage drop • Low leakage current, typical IR less than 0.1 μA • High forward surge capability • Meets environmental standard MIL-S-19500 • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Material categorization: for definitions of co

文件：69.47 Kbytes 页数：4 Pages

VishayVishay Siliconix

威世威世科技公司