FSBB30CH60C分立半导体产品的功率驱动器模块规格书PDF中文资料

FSBB30CH60C属于分立半导体产品的功率驱动器模块。由安森美半导体公司制造生产的FSBB30CH60C功率驱动器模块功率驱动器模块为电源组件（通常为半桥或单相、两相或三相配置的 IGBT 和 MOSFET）提供物理防护。功率半导体或裸片将焊接或烧结在基材上，后者可承载功率半导体并在需要时提供电和热触点以及电绝缘。功率模块提供更高的功率密度，并且在许多情况下更可靠且更易于冷却。

Features

• UL Certified No. E209204 (UL1557)

• 600 V - 30 A 3-Phase IGBT Inverter with Integral Gate Drivers and Protection

• Low-Loss, Short-Circuit Rated IGBTs

• Very Low Thermal Resistance Using AlN DBC Substrate

• Built-in Bootstrap Diodes and Dedicated Vs Pins Simplify PCB Layout

• Separate Open-Emitter Pins from Low-Side IGBTs for Three-Phase Current Sensing

• Single-Grounded Power Supply

• Isolation Rating: 2500 Vrms / min.

Applications

• Motion Control - Home Appliance / Industrial Motor

General Description

FSBB30CH60C is an advanced Motion SPM® 3 module providing a fully-featured, high-performance inverter output stage for AC Induction, BLDC, and PMSM motors. These modules integrate optimized gate drive of the built-in IGBTs to minimize EMI and losses, while also providing multiple on-module protection features including under-voltage lockouts, over-current shutdown, and fault reporting. The built-in, high-speed HVIC requires only a single supply voltage and translates the incoming logic-level gate inputs to the high-voltage, high-current drive signals required to properly drive the module's internal IGBTs. Separate negative IGBT terminals are available for each phase to support the widest variety of control algorithms.