FSB50760BSF数据手册分立半导体产品的功率驱动器模块规格书PDF

描述 Description

The FSB50760BSF is an advanced MotionSPM 5 module providing a fully−featured, high−performance inverteroutput stage for AC Induction, BLDC and PMSM motors such asrefrigerators, fans and pumps. These modules integrate optimized gatedrive of the built−in MOSFETs (SuperFET technology) to minimizeEMI and losses, while also providing multiple on−module protectionfeatures including under−voltage lockouts and thermal monitoring.The built−in high−speed HVIC requires only a single supply voltageand translates the incoming logic−level gate inputs to thehigh−voltage, high−current drive signals required to properly drive themodule’s internal MOSFETs. Separate open−source MOSFETterminals are available for each phase to support the widest variety ofcontrol algorithms.

特性 Features

•UL Certified No. E209204 (UL1557)
• 600 V RDS(ON) = 830 m (Max) SuperFET MOSFET 3−Phase Inverter with Gate Drivers and Protection
• Built−In Bootstrap Diodes Simplify PCB Layout
• Separate Open−Source Pins from Low−Side MOSFETs for Three−Phase Current−Sensing
•Active-HIGH Interface, Works with 3.3 / 5 V Logic, Schmitt-trigger Input
•Optimized for Low Electromagnetic Interference
•HVIC Temperature-Sensing Built-In for Temperature Monitoring
•HVIC for Gate Driving and Under-Voltage Protection
•Isolation Rating: 1500 Vrms / min.
• RoHS Compliant
• Moisture Senstive Level (MSL) 3

应用 Application

• Fan motor
• Washing machine (sub motors)
• Dish washer
• Refrigerator

简介

FSB50760BSF属于分立半导体产品的功率驱动器模块。由制造生产的FSB50760BSF功率驱动器模块功率驱动器模块为电源组件（通常为半桥或单相、两相或三相配置的 IGBT 和 MOSFET）提供物理防护。功率半导体或裸片将焊接或烧结在基材上，后者可承载功率半导体并在需要时提供电和热触点以及电绝缘。功率模块提供更高的功率密度，并且在许多情况下更可靠且更易于冷却。