FSB50550BSL数据手册分立半导体产品的功率驱动器模块规格书PDF

描述 Description

The FSB50550BL (DIP type) is an advanced Motion SPM 5
module providing a fully−featured, high−performance inverter output
stage for AC Induction, BLDC and PMSM motors. These modules
integrate optimized gate drive of the built−in MOSFETs (FRFET®
technology) to minimize EMI and losses, while also
providing multiple on−module protection features including
under−voltage lockouts and thermal monitoring. The built−in
high−speed HVIC requires only a single supply voltage and translates
the incoming logic−level gate inputs to the high−voltage, high−current
drive signals required to properly drive the module’s internal
MOSFETs. Separate open−source MOSFET terminals are available
for each phase to support the widest variety of control algorithms.

More optimized for EMI sensitive applications like fan motor for air conditioner, washing machine, dish washer.

特性 Features

•UL Certified No. E209204 (UL1557)
• Wide coverage from 10W to 200W in 1 footprint
•Optimized for over 10 kHz Switching Frequency
• FET module. Superior ruggedness than IGBT solution
•500 V FRFET MOSFET 3-Phase Inverter with Gate Drivers and Protection
• Various lead options: DIP/Double DIP/Surface mount
•Built-In Bootstrap Diodes Simplify PCB Layout
•Separate Open-Source Pins from Low-Side MOSFETs for Three-Phase Current-Sensing
•Active-HIGH Interface, Works with 3.3 / 5 V Logic, Schmitt-trigger Input
•Optimized for Low Electromagnetic Interference
•HVIC Temperature-Sensing Built-In for Temperature Monitoring
•HVIC for Gate Driving and Under-Voltage Protection
•Isolation Rating: 1500 Vrms / min.
•RoHS Complia

应用 Application

• Fan motor
• Washing machine (sub motors)
• Dish washer
• 3-phase inverter

简介

FSB50550BSL属于分立半导体产品的功率驱动器模块。由制造生产的FSB50550BSL功率驱动器模块功率驱动器模块为电源组件（通常为半桥或单相、两相或三相配置的 IGBT 和 MOSFET）提供物理防护。功率半导体或裸片将焊接或烧结在基材上，后者可承载功率半导体并在需要时提供电和热触点以及电绝缘。功率模块提供更高的功率密度，并且在许多情况下更可靠且更易于冷却。