HybridPACK™ DC6 module with Trench/Fieldstop IGBT3 and emitter controlled 3 diode and NTC

Features • Electrical features - VCES = 700 V - IC nom = 400 A / ICRM = 800 A - Increased blocking voltage capability to 705 V - VCE,sat with positive temperature coefficient - Low VCE,sat - Low switching losses - Low inductive design - Tvj,op = 150°C - Short-time extended operation temp

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HybridPACK ™ DC6 705 V，400 A 三相六组 TRENCHSTOP ™ IGBT3 专为电动汽车应用而设计

HybridPACKTM 1 DC6 700 V, 400 A 3-phase six-pack TRENCHSTOPTM IGBT3 with matching emitter controlled diode automotive qualified power module designed for electric vehicle applications. \n The HybridPACKTM 1 power module is built on Infineon’s long time experience in the development of IGBT pow • Increased blocking voltage capability to 705 V\n• VCEsat with positive temperature coefficient\n• Low VCEsat \n• Low switching losses\n• Low inductive design\n• Tvj op = 150°C\n• Short-time extended operation temperature Tvj op = 175°C\n• 2.5 kV AC 1min insulation\n• Al2O3substrate with low therma;

Infineon

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HybridPACK™ DC6 module with Trench/Fieldstop IGBT3 and emitter controlled 3 diode and NTC

Features • Electrical features - VCES = 700 V - IC,nom = 400 A - Low switching losses - Low VCE,sat - Tvj,op = 150°C - VCE,sat with positive temperature coefficient - Increased blocking voltage capability to 705 V - Low inductive design • Mechanical features - 2.5 kV AC 1 minute insulat

文件：678.9 Kbytes 页数：15 Pages

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汽车IGBT模块

HybridPACK™1 DC6 Wave 700 V, 400 A six-pack TRENCHSTOPTM IGBT3 with emitter controlled diode and NTC is a very compact power module optimized for hybrid and electric vehicle main inverter applications (xEV) based on established solder and screw interconnections.  • Low Switching losses\n• Low VCEsat \n• Tvj op = 150°C\n• VCEsat with positive Temperature Coefficient\n• Increased blocking voltage capability to 705 VMechanical Features\n• 2.5 kV AC 1min Insulation\n• Al2O3 Substrate with Low Thermal Resistance\n• Direct Cooled PinFin Base Plate\n• High mechanic;

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包装：托盘 类别：分立半导体产品 晶体管 - IGBT - 模块 描述：IGBT MODULE

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Package：模块；包装：托盘 类别：分立半导体产品 晶体管 - IGBT - 模块 描述：IGBT MODULE 650V 400A

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