FP75R12KT4P

IGBT模块; • Low stray inductance module design\n• High reliability and power density\n• Copper base plate for optimized heat spread\n• Solderable pins\n• Low switching losses\n• High switching frequency\n• RoHS-compliant modules\n\n优势:\n• Compact module concept\n• Optimized customer’s development cycle time and cost\n• Configuration flexibility\n;

EconoPIM™ 3 1200 V, 75 A three phase PIM IGBT module with fast TRENCHSTOP™ IGBT4, Emitter Controlled 4 diode, NTC and pre-applied Thermal Interface Material. The PIM (Power Integrated Modules) with integration of rectifier and brake chopper enables system cost savings. They are available in Econo 2 and Econo 3 housing and also available with Solder- or PressFIT pins.\n

FP75R12KT4P

EconoPIM3 Modul mit schnellem Trench

FP75R12KT4P_B11

IGBT模块; • 低开关损耗\n• 低 VCEsat\n• Tvj op = 150°C\n• VCEsat 带正温度系数\n• 高功率循环和温度循环能力\n• 集成温度检测 NTC 温度传感器\n• 铜基板\n• 标准外壳\n\n\n优势:\n• 紧凑模块的概念\n• 优化客户的开发周期，降低成本\n• 灵活的配置\n \n;

EconoPIM™ 3 1200V 三相PIM IGBT 模块，采用第四代快速沟槽栅/场终止 IGBT、第四代发射极控制二极管、NTC 温度检测和 PressFIT 压接技术以及热界面材料\n \n   \n

FP75R12KT4P_B11

EconoPIM3 Modul mit schnellem Trench

FP75R12KT4PB11BPSA1

Package：模块；包装：托盘 类别：分立半导体产品 晶体管 - IGBT - 模块 描述：IGBT MOD 1200V 150A 20MW

FP75R12KT4PBPSA1

Package：模块；包装：托盘 类别：分立半导体产品 晶体管 - IGBT - 模块 描述：IGBT MOD 1200V 150A 20MW