EconoPIM3 Modul mit Trench

文件：755.77 Kbytes 页数：12 Pages

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IGBT模块

EconoPIM™ 3 1200V three phase PIM IGBT module with fast Trench/Fieldstop IGBT4, Emitter Controlled 4 diode and NTC.\n \n   � • Low Switching Losses\n• Low V CEsat\n• T vj op = 150°C\n• V CEsat with positive Temperature Coefficient\n• High Power and Thermal Cycling Capability\n• Integrated NTC temperature sensor\n• Copper Base Plate\n• Standard Housing\n\n优势:\n• Compact module concept\n• Optimized customer’s development cy;

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EiceDRIVER™ 1ED314xMU12F (1ED-X3 Compact)

Features • Single-channel isolated gate driver • For use with 600 V/650 V/1200 V/1700 V/2300 V IGBTs, Si and SiC MOSFETs • Up to 6.5 A typical peak output current • 45 ns propagation delay with 7 ns part-to-part matching (skew) • 35 V absolute maximum output supply voltage • High common-mode

文件：4.24411 Mbytes 页数：34 Pages

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EconoPIM3 Modul mit Trench

文件：787.56 Kbytes 页数：12 Pages

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EconoPIM3 Modul mit Trench

文件：762.85 Kbytes 页数：12 Pages

Infineon

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EconoPIM3 Modul mit Trench

文件：797.22 Kbytes 页数：12 Pages

Infineon

英飞凌

IGBT模块

EconoPIM™ 3 1200V three phase PIM IGBT module with fast Trench/Fieldstop IGBT4, Emitter Controlled 4 diode, NTC and pre-applied Thermal Interface Material.\n • Low Switching Losses\n• Low V CEsat\n• T vj op = 150°C\n• V CEsat with positive Temperature Coefficient\n• High Power and Thermal Cycling Capability\n• Integrated NTC temperature sensor\n• Copper Base Plate\n• Standard Housing\n\n优势:\n• Compact module concept\n• Optimized customer’s development cy;

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1200 V、150 A PIM三相输入整流器IGBT模块

EconoPIM™ 3 1200V three phase PIM IGBT module with fast Trench/Fieldstop IGBT4, Emitter Controlled Diode, NTC, PressFIT Contact Technology and pre-applied Thermal Interface Material.\n \n   • Low Switching Losses\n• Low V CEsat\n• T vj op = 150°C\n• V CEsat with positive Temperature Coefficient\n• High Power and Thermal Cycling Capability\n• Integrated NTC temperature sensor\n• Copper Base Plate\n• Standard Housing\n\n优势:\n• Compact module concept\n• Optimized customer’s development cy;

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Package：模块；包装：托盘 类别：分立半导体产品 晶体管 - IGBT - 模块 描述：IGBT MODULE 1200V 150A

Infineon

英飞凌

Package：模块；包装：托盘 类别：分立半导体产品 晶体管 - IGBT - 模块 描述：IGBT MODULE 1200V 150A

Infineon

英飞凌