Ultra-low profile FPC connector

文件：895.42 Kbytes 页数：4 Pages

DDK

XHP™2 module with CoolSiC™ Trench MOSFET

Features • Electrical features - VDSS = 3300 V - IDN = 750 A / IDRM = 1500 A - Tvj,op = 175°C - Low switching losses - High current density - Low inductive design • Mechanical features - High power density - Package with CTI > 600 - High creepage and clearance distances - AlSiC base pl

文件：698.34 Kbytes 页数：17 Pages

INFINEON

英飞凌

Ultra-low profile FPC connector

文件：895.42 Kbytes 页数：4 Pages

DDK

Ultra-low profile FPC connector

文件：895.42 Kbytes 页数：4 Pages

DDK

CoolSiC ™ MOSFET 半桥模块 3.3 kV

• CoolSiC ™ MOSFET 3.3 kV\n • 集成体二极管\n • XHP ™ 2 外壳\n • .XT互连技术;

Infineon

英飞凌

Ribbon Cable Assembly

Foxconn

富士康