IGBT模块

1700V PrimePACK™2 dual IGBT module with IGBT5 and .XT interconnection technology, Trench/Fieldstop IGBT5, Emitter Controlled 5 diode and NTC.\n • Extended operating temperature (T vjop = 175°C)\n• Output current increased by more than 25% in the same footprint\n• Copper Bonds for high current carrying capabilities\n• Sintering of chips for highest power cycling capabilities\n• Total losses reduced by up to 20%\n• Package with CTI > ;

Infineon

英飞凌

1200 V、1500 A 双IGBT模块

Infineon

英飞凌

1700 V、1500 A 双IGBT模块

Infineon

英飞凌

Package：模块；包装：托盘 类别：分立半导体产品 晶体管 - IGBT - 模块 描述：IGBT MOD 1200V 1500A AGPRIME3+-5

INFINEON

英飞凌

Package：模块；包装：托盘 类别：分立半导体产品 晶体管 - IGBT - 模块 描述：IGBT MOD 1700V 1500A 20MW

INFINEON

英飞凌

Package：模块；包装：托盘 类别：分立半导体产品 晶体管 - IGBT - 模块 描述：IGBT MOD 1700V 1500A AGPRIME3+-5

INFINEON

英飞凌