DUAL COOL??PACKAGE POWERTRENCH짰 MOSFETs

Dual Cool™ packaging technology, provides both bottom- and top-side cooling in a PQFN package. Not only is the PQFN footprint an industry standard, it provides the designer with performance flexibility. With enhanced dual path thermal performance and improved parasitics over its wire-bonded predece

文件：1.16337 Mbytes 页数：2 Pages

FAIRCHILD

仙童半导体

25V N沟道PowerTrench® SyncFET™

此N沟道SyncFET™ 采用飞兆半导体先进的PowerTrench®工艺生产。先进的硅技术和封装技术完美融合，可在提供最小RDS(on)的同时通过极低的结至环境热阻保持卓越的开关性能。 该器件可被额外作为一个有效的单片肖特基体二极管使用。 Dual Cool™ PQFN封装\n在VGS = 10 V且ID = 28 A时，最大值RDS(on) = 2.8 mΩ\n在VGS = 4.5 V且ID = 25 A时，最大值RDS(on) = 3.3 mΩ\n高性能技术可实现极低的RDS(ON)\nSyncFET™ 肖特基体二极管\n符合RoHS标准;

ONSEMI

安森美半导体

Heyco® Nylon Conduit Fittings - Straight-Thru

文件：144.65 Kbytes 页数：1 Pages

HEYCO

Heyco® Nylon Conduit Fittings - Straight-Thru

文件：144.65 Kbytes 页数：1 Pages

HEYCO

/- 5V Supply, ARINC 429 LINE DRIVER

DESCRIPTION The HI-8570 and HI-8571 are CMOS integrated circuits designed to directly drive the ARINC 429 bus in an 8-pin package. Two logic inputs control a differential voltage between the output pins producing a +10 volt One, a -10 volt Zero, and a 0 volt Null. FEATURES • Direct ARINC 429 li

文件：130.19 Kbytes 页数：8 Pages

HOLTIC

霍尔特