2.4 GHz Wi-Fi Bluetooth® Bluetooth LE SiP

Features CPU and On-Chip Memory • Xtensa® dual-core 32-bit LX6 microprocessor, up to 240 MHz • 448 KB ROM • 520 KB SRAM • 16 KB SRAM in RTC Wi-Fi • Complies with 802.11b/g/n • 1T1R mode with data rate up to 150 Mbps • TX/RX A-MPDU and RX A-MSDU aggregation • 0.4 μs guard interval suppor

文件：4.42924 Mbytes 页数：64 Pages

ESPRESSIF

乐鑫信息科技

基于 ESP32 的系统级封装 (SiP) 模组

Espressif

乐鑫信息科技

Package：48-TFQFN 裸露焊盘；包装：卷带（TR）剪切带（CT）Digi-Reel® 得捷定制卷带 类别：RF/IF，射频/中频和 RFID 射频收发器模块和调制解调器 描述：RX TXRX MOD WIFI SURFACE MOUNT

Espressif Systems

2.4 GHz WiFi Bluetooth® Bluetooth LE module Built around ESP32 series of SoCs, Xtensa® dualcore Flash up to 8 MB, PSRAM up to 2 MB 27 GPIOs, rich set of peripherals On-board PCB antenna or external antenna connector

1.1 Features CPU and OnChip Memory • ESP32-PICO-V3-02 embedded, Xtensa dual-core 32-bit LX6 microprocessor, up to 240 MHz • 448 KB ROM for booting and core functions • 520 KB SRAM for data and instructions • 16 KB SRAM in RTC • 8 MB SPI flash • 2 MB PSRAM WiFi • 802.11b/g/n • Bit rate

文件：923.21 Kbytes 页数：33 Pages

ESPRESSIF

乐鑫信息科技

2.4 GHz Wi-Fi Bluetooth® Bluetooth LE SiP

Features CPU and On-Chip Memory • Xtensa® dual-core 32-bit LX6 microprocessor, up to 240 MHz • 448 KB ROM • 520 KB SRAM • 16 KB SRAM in RTC Wi-Fi • Complies with 802.11b/g/n • 1T1R mode with data rate up to 150 Mbps • TX/RX A-MPDU and RX A-MSDU aggregation • 0.4 μs guard interval suppor

文件：4.42924 Mbytes 页数：64 Pages

ESPRESSIF

乐鑫信息科技

Alexa Connect Kit (ACK) module with an Espressif chipset

1.1 Features CPU and On-Chip Memory • ESP32 embedded, Xtensa dual-core 32-bit LX6 microprocessor, up to 240 MHz • 448 KB ROM • 520 KB SRAM • 16 KB SRAM in RTC Wi-Fi • 802.11b/g/n • Bit rate: 802.11n up to 150 Mbps • A-MPDU and A-MSDU aggregation • 0.4 μs guard interval support • Center

文件：738.02 Kbytes 页数：46 Pages

ESPRESSIF

乐鑫信息科技

通用型 Wi-Fi + Bluetooth® + Bluetooth® LE MCU 模组

ESP32-PICO-V3-ZERO 是乐鑫的 Alexa Connect Kit (ACK) 模组。基于该模组，用户无需管理云服务、编写 Alexa Skill、手机 APP 或其他复杂设备，即可轻松构建兼容 Alexa 的设备。该模组基于系统级封装 (SiP) ESP32-PICO-V3，体积紧凑、性能强劲及功耗低，可提供完整的 Wi-Fi 和蓝牙® 功能。

Espressif

乐鑫信息科技

基于 ESP32 (ECO V3) 的系统级封装 (SiP) 产品

Espressif

乐鑫信息科技

Package：48-LFQFN 裸露焊盘；包装：卷带（TR）剪切带（CT）Digi-Reel® 得捷定制卷带 类别：RF/IF，射频/中频和 RFID 射频收发器模块和调制解调器 描述：SIP MODULE WIFI BLE COMBO

Espressif Systems