ESP32-PICO-V3

2.4 GHz Wi-Fi Bluetooth® Bluetooth LE SiP

Features CPUandOn-ChipMemory •Xtensa®dual-core32-bitLX6microprocessor, upto240MHz •448KBROM •520KBSRAM •16KBSRAMinRTC Wi-Fi •Complieswith802.11b/g/n •1T1Rmodewithdatarateupto150Mbps •TX/RXA-MPDUandRXA-MSDUaggregation •0.4μsguardintervalsuppor

ESP32-PICO-V3

Package：48-TFQFN 裸露焊盘；包装：卷带（TR）剪切带（CT）Digi-Reel® 得捷定制卷带 类别：RF/IF，射频/中频和 RFID 射频收发器模块和调制解调器 描述：RX TXRX MOD WIFI SURFACE MOUNT

ESP32-PICO-V3-02

2.4 GHz WiFi Bluetooth® Bluetooth LE module Built around ESP32 series of SoCs, Xtensa® dualcore Flash up to 8 MB, PSRAM up to 2 MB 27 GPIOs, rich set of peripherals On-board PCB antenna or external antenna connector

1.1Features CPUandOnChip Memory •ESP32-PICO-V3-02embedded,Xtensa dual-core32-bitLX6microprocessor,upto240 MHz •448KBROMforbootingandcorefunctions •520KBSRAMfordataandinstructions •16KBSRAMinRTC •8MBSPIflash •2MBPSRAM WiFi •802.11b/g/n •Bitrate

ESP32-PICO-V3-02

2.4 GHz Wi-Fi Bluetooth® Bluetooth LE SiP

Features CPUandOn-ChipMemory •Xtensa®dual-core32-bitLX6microprocessor, upto240MHz •448KBROM •520KBSRAM •16KBSRAMinRTC Wi-Fi •Complieswith802.11b/g/n •1T1Rmodewithdatarateupto150Mbps •TX/RXA-MPDUandRXA-MSDUaggregation •0.4μsguardintervalsuppor

ESP32-PICO-V3-ZERO

Alexa Connect Kit (ACK) module with an Espressif chipset

1.1Features CPUandOn-ChipMemory •ESP32embedded,Xtensadual-core32-bitLX6 microprocessor,upto240MHz •448KBROM •520KBSRAM •16KBSRAMinRTC Wi-Fi •802.11b/g/n •Bitrate:802.11nupto150Mbps •A-MPDUandA-MSDUaggregation •0.4μsguardintervalsupport •Center

ESP32-PICO-V3-02

Package：48-LFQFN 裸露焊盘；包装：卷带（TR）剪切带（CT）Digi-Reel® 得捷定制卷带 类别：RF/IF，射频/中频和 RFID 射频收发器模块和调制解调器 描述：SIP MODULE WIFI BLE COMBO