丝印：ES1C；Package：SMA；1.0 A Ultra Fast Recovery Rectifier

Features • For Surface Mount Applications • Glass Passivated Junction • Low Profile Package • Easy Pick and Place • Built−in Strain Relief • Superfast Recovery Times for High Efficiency • This Device is Pb−Free and is RoHS Compliant Applications • This Product is General Usage and Suitabl

文件：162.37 Kbytes 页数：6 Pages

ONSEMI

安森美半导体

丝印：ES1CB；Package：DO-214AA；Surface Mount Super Fast Recovery Rectifier ES1AB Through ES1KB

Features Low profile package Ideal for automated placement Glass passivated chip junction High forward surge capability Super Fast reverse recovery time Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C

文件：3.24264 Mbytes 页数：4 Pages

RFE

RFE international

丝印：ES1C；Package：SMAF；Surface Mount Superfast Recovery Rectifier

Features For surface mounted applications Low profile package Glass passivated chip junction Superfast reverse recovery time Lead free in comply with EU RoHS 2011/65/EU directives

文件：2.36198 Mbytes 页数：4 Pages

UNSEMI

优恩半导体

丝印：ES1D；Package：SMA；Surface Mount Superfast Recovery Rectifier

Features For surface mounted applications Low profile package Glass Passivated Chip Junction Superfast reverse recovery time Lead free in comply with EU RoHS 2011/65/EU directives

文件：2.32931 Mbytes 页数：4 Pages

UNSEMI

优恩半导体

丝印：ES1D；Package：DO-214AC；Surface Mount Super Fast Recifier Diodes ES1A Through ES1K

FEATURES Low profile package Ideal for automated placement Glass passivated chip junction High forward surge capability Super Fast reverse recovery time Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C

文件：1.08034 Mbytes 页数：3 Pages

RFE

RFE international

丝印：ES1D；Package：SMA；1.0 A Ultra Fast Recovery Rectifier

Features • For Surface Mount Applications • Glass Passivated Junction • Low Profile Package • Easy Pick and Place • Built−in Strain Relief • Superfast Recovery Times for High Efficiency • This Device is Pb−Free and is RoHS Compliant Applications • This Product is General Usage and Suitabl

文件：162.37 Kbytes 页数：6 Pages

ONSEMI

安森美半导体

丝印：ES1DAF；Package：DO-214AD；Surface Mount Ultrafast Rectifier

Features • Fast Switching Speed – Maximum Trr 35 ns • Ultra Thin Profile − Maximum Height of 1.0 mm • Glass Passivated Junction • UL Flammability 94V−0 Classification • MSL 1 • Green Mold Compound • These Devices are Pb−Free, Halogen Free Free and are RoHS Compliant

文件：235.63 Kbytes 页数：5 Pages

ONSEMI

安森美半导体

丝印：ES1DAF；Package：DO-214AD；Surface Mount Ultrafast Rectifier

Features • Fast Switching Speed – Maximum Trr 35 ns • Ultra Thin Profile − Maximum Height of 1.0 mm • Glass Passivated Junction • UL Flammability 94V−0 Classification • MSL 1 • Green Mold Compound • These Devices are Pb−Free, Halogen Free Free and are RoHS Compliant

文件：274.05 Kbytes 页数：6 Pages

ONSEMI

安森美半导体

丝印：ES1DB；Package：DO-214AA；Surface Mount Super Fast Recovery Rectifier ES1AB Through ES1KB

Features Low profile package Ideal for automated placement Glass passivated chip junction High forward surge capability Super Fast reverse recovery time Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C

文件：3.24264 Mbytes 页数：4 Pages

RFE

RFE international

丝印：ES1D；Package：SMAF；Surface Mount Superfast Recovery Rectifier

Features For surface mounted applications Low profile package Glass passivated chip junction Superfast reverse recovery time Lead free in comply with EU RoHS 2011/65/EU directives

文件：2.36198 Mbytes 页数：4 Pages

UNSEMI

优恩半导体