配件-骨架外壳

Fuantronics

富安电子

Amorphous Photosensors

文件：41.64 Kbytes 页数：2 Pages

SANYO

三洋

High frequency, high current power inductors

文件：435.21 Kbytes 页数：5 Pages

EATON

伊顿

ENHANCED PERFORMANCE SURFACE MOUNT EPSM PACKAGED DEVICES

DESCRIPTION Our EPSM packaged devices are designed for the most demanding commercial and Military requirements where the inconsistent performance inherent in plastic surface mount packages cannot be tolerated. These package styles extend the surface mount construction format to 6 GHz for high per

文件：290.19 Kbytes 页数：4 Pages

MICROSEMI

美高森美