8th/9th Gen Coffee Lake-S 3.5” Micro Module

Features • Top Layer Soldered Socket • Supports 9th/8th Gen Intel® Coffee Lake-S CoreTM/ Pentium®/Celeron® Processors • Intel® Q370/H310 Express Chipset • Intel® UHD Graphics 630/610 • Single DRAM Socket, Max. Up to 32GB DDR4 2666MHz • Triple Display (2 x HDMI, LVDS) • 2 x USB 2.0, 4 x USB 3.1 (

文件：446.61 Kbytes 页数：1 Pages

BCM

8th/9th Gen Coffee Lake-S 3.5” Micro Module

Features • Top Layer Soldered Socket • Supports 9th/8th Gen Intel® Coffee Lake-S CoreTM/ Pentium®/Celeron® Processors • Intel® Q370/H310 Express Chipset • Intel® UHD Graphics 630/610 • Single DRAM Socket, Max. Up to 32GB DDR4 2666MHz • Triple Display (2 x HDMI, LVDS) • 2 x USB 2.0, 4 x USB 3.1 (

文件：446.61 Kbytes 页数：1 Pages

BCM

Intel® Celeron®/Atom™ Elkhart Lake SoC 3.5” Micro Module

Features • Intel® Celeron®/Atom™ Elkhart Lake SoC BGA Processor • Bottom Layer Soldered Processor • 1 x SODIMM socket supports up to 32GB DDR4 3200MTs SDRAM • Supports 3 Independent Displays • M.2 B-Key, M.2 E-Key, uSIM Card Slot • 4 x COM Ports • 2 x USB 3.1 Gen 2 (10Gbps), 4 x USB 2.0 • 2 x In

文件：1.72373 Mbytes 页数：1 Pages

BCM

Intel® Celeron®/Atom™ Elkhart Lake SoC 3.5” Micro Module

Features • Intel® Celeron®/Atom™ Elkhart Lake SoC BGA Processor • Bottom Layer Soldered Processor • 1 x SODIMM socket supports up to 32GB DDR4 3200MTs SDRAM • Supports 3 Independent Displays • M.2 B-Key, M.2 E-Key, uSIM Card Slot • 4 x COM Ports • 2 x USB 3.1 Gen 2 (10Gbps), 4 x USB 2.0 • 2 x In

文件：1.72373 Mbytes 页数：1 Pages

BCM

Intel® Celeron®/Atom™ Elkhart Lake SoC 3.5” Micro Module

Features • Intel® Celeron®/Atom™ Elkhart Lake SoC BGA Processor • Bottom Layer Soldered Processor • 1 x SODIMM socket supports up to 32GB DDR4 3200MTs SDRAM • Supports 3 Independent Displays • M.2 B-Key, M.2 E-Key, uSIM Card Slot • 4 x COM Ports • 2 x USB 3.1 Gen 2 (10Gbps), 4 x USB 2.0 • 2 x In

文件：1.72373 Mbytes 页数：1 Pages

BCM

Intel® Celeron®/Atom™ Elkhart Lake SoC 3.5” Micro Module

Features • Intel® Celeron®/Atom™ Elkhart Lake SoC BGA Processor • Bottom Layer Soldered Processor • 1 x SODIMM socket supports up to 32GB DDR4 3200MTs SDRAM • Supports 3 Independent Displays • M.2 B-Key, M.2 E-Key, uSIM Card Slot • 4 x COM Ports • 2 x USB 3.1 Gen 2 (10Gbps), 4 x USB 2.0 • 2 x In

文件：1.72373 Mbytes 页数：1 Pages

BCM

Intel® Celeron®/Atom™ Elkhart Lake SoC 3.5” Micro Module

Features • Intel® Celeron®/Atom™ Elkhart Lake SoC BGA Processor • Bottom Layer Soldered Processor • 1 x SODIMM socket supports up to 32GB DDR4 3200MTs SDRAM • Supports 3 Independent Displays • M.2 B-Key, M.2 E-Key, uSIM Card Slot • 4 x COM Ports • 2 x USB 3.1 Gen 2 (10Gbps), 4 x USB 2.0 • 2 x In

文件：1.72373 Mbytes 页数：1 Pages

BCM

ESD protected common mode filter for USB3.0 interface

Description The ECMF02-2HSMX6 is a highly integrated common mode filter designed to suppress EMI/RFI common mode noise on high speed differential serial buses like the USB3.0 transceiver. Features • High common mode attenuation: – -10 dB @ 300 MHz – -20 dB @ 2.4 and 5 GHz – -15 dB from

文件：888.51 Kbytes 页数：17 Pages

STMICROELECTRONICS

意法半导体

丝印：KK；Package：uQFN-10L；Common mode filter with ESD protection for high speed serial interface

Description This device is a highly integrated common mode filter designed to suppress EMI/RFI common mode noise on high speed differential serial buses like HDMI Full HD, MIPI, Display Port and other high speed serial interfaces.The device has a very large differential bandwidth to comply w

文件：483.02 Kbytes 页数：13 Pages

STMICROELECTRONICS

意法半导体

丝印：ML；Package：UQFN-6L；Common mode filter with ESD protection for high speed serial interface

Features • 10.7 GHz differential bandwidth to comply with HDMI 2.1, HDMI 2.0, HDMI 1.4, USB4, USB 3.2 Gen2, USB 2.0, MIPI, Display port 2.0, etc. • High common mode attenuation on WLAN frequencies: – -15 dB at 2.4 GHz – -21 dB at 5.0 GHz – -17 dB at 6.0 GHz • Low serial resistance: 3.0 Ω •

文件：6.49812 Mbytes 页数：17 Pages

STMICROELECTRONICS

意法半导体