EC55

U.H.F. DISC-SEAL TRIODE

ETC

EC550-HD

4th Gen Intel® CoreTM Modular-Designed Embedded System

Features •SupportsDDR3SODIMMupto16GB •2x2.5SATAdrivebays •5expansionslots

EC550-HD4861

4th Gen Intel® CoreTM Modular-Designed Embedded System

Features •SupportsDDR3SODIMMupto16GB •2x2.5SATAdrivebays •5expansionslots

EC551-HD4861

4th Gen Intel® CoreTM Modular-Designed Embedded System

Features •SupportsDDR3SODIMMupto16GB •2x2.5SATAdrivebays •5expansionslots

EC5575A

14+1 Channels Voltage Buffer with OTP/OCP; • SupplyVoltageRange：6V~18V\n• Rail-to-Rail Output Voltage Swing\n• High Slew Rate：\n--- Vcom Buffer：30V/µs\n--- Gamma Buffer：2V/µs\n• Thermal Shutdown Protection \n• Short-Circuit Current Limit Protection\n• Continuous Output Drive current：\n--- Vcom Buffer：±100mA(Max)\n--- Gamma Buffer：±30mA(Max)\n• Ultra-small Package TQFP-48L(Exposed Pad)\n;

The EC5575A is a 14+1 channel voltage buffers that buffers reference voltage for gammacorrectioninathinfilmtransistor liquid crystal display (TFT LCD). This device incorporating a Vcom amplifier circuit, four rail to rail buffer amplifier circuits(thehighesttwostageandlowest two stage) and 10 buffer amplifiers circuits. TheEC5575Aisavailableinaspacesaving 48-pinTQFPpackage,andtheoperating temperature isfrom–20°C to+85°C.\n\n \n\n

EC550

4th Gen Intel Core Modular-Designed Embedded System

EC5525NP-1

Proximity Sensors Capacitive Flat Pack Polycarbonate Housing

EC5525NPAP

Proximity Sensors Capacitive Flat Pack Polycarbonate Housing

EC5525NPAP-1

Proximity Sensors Capacitive Flat Pack Polycarbonate Housing

EC5525PPAP

Proximity Sensors Capacitive Flat Pack Polycarbonate Housing