丝印：EC3293；Package：SOP-8L；3A, 18V, Synchronous Step-down DC/DC Converter

文件：821.12 Kbytes 页数：11 Pages

E-CMOS

飞虹高科

Low-Frequency General-Purpose Amplifier Applications

Low-Frequency General-Purpose Amplifier Applications Features • Ultraminiature package facilitates miniaturization in end products.

文件：35.65 Kbytes 页数：4 Pages

SANYO

三洋

Muting Circuit Applications

Features • Ultrasmall-sized package, facilitates miniaturization in end products. • Low output capacitance. • Low collector-to-emitter saturation voltage. • Low ON-resistance.

文件：28.39 Kbytes 页数：4 Pages

SANYO

三洋

3rd/2nd Gen Intel® CoreTM Modular-Designed Embedded Systems

Features • Fanless, compact design for industrial applications • Supports DDR3/DDR3L SODIMM up to 16GB • Up to 2x 2.5 SATA drive bay, 1 CF socket • Supports mSATA via the mini PCIe slot • 2 PCIe x16 expansions (x8 signal)

文件：1.61668 Mbytes 页数：4 Pages

DFI

友通资讯

3rd/2nd Gen Intel® CoreTM Modular-Designed Embedded Systems

Features • Fanless, compact design for industrial applications • Supports DDR3/DDR3L SODIMM up to 16GB • Up to 2x 2.5 SATA drive bay, 1 CF socket • Supports mSATA via the mini PCIe slot • 2 PCIe x16 expansions (x8 signal)

文件：1.61668 Mbytes 页数：4 Pages

DFI

友通资讯

3rd/2nd Gen Intel® CoreTM Modular-Designed Embedded Systems

Features • Fanless, compact design for industrial applications • Supports DDR3/DDR3L SODIMM up to 16GB • Up to 2x 2.5 SATA drive bay, 1 CF socket • Supports mSATA via the mini PCIe slot • 2 PCIe x16 expansions (x8 signal)

文件：1.61668 Mbytes 页数：4 Pages

DFI

友通资讯

3rd/2nd Gen Intel® CoreTM Modular-Designed Embedded Systems

Features • Fanless, compact design for industrial applications • Supports DDR3/DDR3L SODIMM up to 16GB • Up to 2x 2.5 SATA drive bay, 1 CF socket • Supports mSATA via the mini PCIe slot • 2 PCIe x16 expansions (x8 signal)

文件：1.61668 Mbytes 页数：4 Pages

DFI

友通资讯

3rd/2nd Gen Intel® CoreTM Modular-Designed Embedded Systems

Features • Fanless, compact design for industrial applications • Supports DDR3/DDR3L SODIMM up to 16GB • Up to 2x 2.5 SATA drive bay, 1 CF socket • Supports mSATA via the mini PCIe slot • 2 PCIe x16 expansions (x8 signal)

文件：1.61668 Mbytes 页数：4 Pages

DFI

友通资讯

3rd/2nd Gen Intel® CoreTM Modular-Designed Embedded Systems

Features • Fanless, compact design for industrial applications • Supports DDR3/DDR3L SODIMM up to 16GB • Up to 2x 2.5 SATA drive bay, 1 CF socket • Supports mSATA via the mini PCIe slot • 2 PCIe x16 expansions (x8 signal)

文件：1.61668 Mbytes 页数：4 Pages

DFI

友通资讯

Modular-Designed Embedded System

文件：1.3934 Mbytes 页数：4 Pages

DFI

友通资讯