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E38D521112

COM Express Type 6 Compact Module with 8th Gen Intel® Core™ & Celeron® Processor

Features ● 8th gen Intel® Core™ i7/i5/i3 and Celeron® processors (Whiskey Lake-U) ● 2 dual-channel DDR4-2400 SO-DIMM for up to 64GB ● Max. up to 8 lanes of PCI Express ● 3 SATA Gen3 ● 4 USB 3.0 and 8 USB 2.0 ● Supports eMMC for up to 64G (optional) ● TPM 2.0 supported ● AMS.AXView intellig

文件:510.76 Kbytes 页数:3 Pages

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E38D530102

COM Express Type 6 Basic Module with Intel® Xeon® or 9th/8th Gen Intel® Core™ Processor and Intel® CM246/QM370

Features ● Intel® Xeon® or 9th/8th gen Intel® Core™ processor ● Intel® CM246/QM370 chipset ● Dual channel DDR4-2666 SO-DIMM for up to 64GB of memory ● 1 PCIe x16 and 8 PCIe x1 Gen3 ● 4 SATA Gen3 with RAID 0/1/5/10 ● 4 USB 3.2 and 8 USB 2.0 ● Supports TPM 2.0

文件:508.15 Kbytes 页数:3 Pages

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E38D530105

COM Express Type 6 Basic Module with Intel® Xeon® or 9th/8th Gen Intel® Core™ Processor and Intel® CM246/QM370

Features ● Intel® Xeon® or 9th/8th gen Intel® Core™ processor ● Intel® CM246/QM370 chipset ● Dual channel DDR4-2666 SO-DIMM for up to 64GB of memory ● 1 PCIe x16 and 8 PCIe x1 Gen3 ● 4 SATA Gen3 with RAID 0/1/5/10 ● 4 USB 3.2 and 8 USB 2.0 ● Supports TPM 2.0

文件:508.15 Kbytes 页数:3 Pages

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E38D530106

COM Express Type 6 Basic Module with Intel® Xeon® or 9th/8th Gen Intel® Core™ Processor and Intel® CM246/QM370

Features ● Intel® Xeon® or 9th/8th gen Intel® Core™ processor ● Intel® CM246/QM370 chipset ● Dual channel DDR4-2666 SO-DIMM for up to 64GB of memory ● 1 PCIe x16 and 8 PCIe x1 Gen3 ● 4 SATA Gen3 with RAID 0/1/5/10 ● 4 USB 3.2 and 8 USB 2.0 ● Supports TPM 2.0

文件:508.15 Kbytes 页数:3 Pages

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E38D530107

COM Express Type 6 Basic Module with Intel® Xeon® or 9th/8th Gen Intel® Core™ Processor and Intel® CM246/QM370

Features ● Intel® Xeon® or 9th/8th gen Intel® Core™ processor ● Intel® CM246/QM370 chipset ● Dual channel DDR4-2666 SO-DIMM for up to 64GB of memory ● 1 PCIe x16 and 8 PCIe x1 Gen3 ● 4 SATA Gen3 with RAID 0/1/5/10 ● 4 USB 3.2 and 8 USB 2.0 ● Supports TPM 2.0

文件:508.15 Kbytes 页数:3 Pages

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E38D530108

COM Express Type 6 Basic Module with Intel® Xeon® or 9th/8th Gen Intel® Core™ Processor and Intel® CM246/QM370

Features ● Intel® Xeon® or 9th/8th gen Intel® Core™ processor ● Intel® CM246/QM370 chipset ● Dual channel DDR4-2666 SO-DIMM for up to 64GB of memory ● 1 PCIe x16 and 8 PCIe x1 Gen3 ● 4 SATA Gen3 with RAID 0/1/5/10 ● 4 USB 3.2 and 8 USB 2.0 ● Supports TPM 2.0

文件:508.15 Kbytes 页数:3 Pages

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E38D530110

COM Express Type 6 Basic Module with Intel® Xeon® or 9th/8th Gen Intel® Core™ Processor and Intel® CM246/QM370

Features ● Intel® Xeon® or 9th/8th gen Intel® Core™ processor ● Intel® CM246/QM370 chipset ● Dual channel DDR4-2666 SO-DIMM for up to 64GB of memory ● 1 PCIe x16 and 8 PCIe x1 Gen3 ● 4 SATA Gen3 with RAID 0/1/5/10 ● 4 USB 3.2 and 8 USB 2.0 ● Supports TPM 2.0

文件:508.15 Kbytes 页数:3 Pages

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E38D530111

COM Express Type 6 Basic Module with Intel® Xeon® or 9th/8th Gen Intel® Core™ Processor and Intel® CM246/QM370

Features ● Intel® Xeon® or 9th/8th gen Intel® Core™ processor ● Intel® CM246/QM370 chipset ● Dual channel DDR4-2666 SO-DIMM for up to 64GB of memory ● 1 PCIe x16 and 8 PCIe x1 Gen3 ● 4 SATA Gen3 with RAID 0/1/5/10 ● 4 USB 3.2 and 8 USB 2.0 ● Supports TPM 2.0

文件:508.15 Kbytes 页数:3 Pages

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E38D530113

COM Express Type 6 Basic Module with Intel® Xeon® or 9th/8th Gen Intel® Core™ Processor and Intel® CM246/QM370

Features ● Intel® Xeon® or 9th/8th gen Intel® Core™ processor ● Intel® CM246/QM370 chipset ● Dual channel DDR4-2666 SO-DIMM for up to 64GB of memory ● 1 PCIe x16 and 8 PCIe x1 Gen3 ● 4 SATA Gen3 with RAID 0/1/5/10 ● 4 USB 3.2 and 8 USB 2.0 ● Supports TPM 2.0

文件:508.15 Kbytes 页数:3 Pages

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E38D561100

COM Express Type 6 Compact Module with 13th/12th Gen Intel® Core™ or Celeron® Processor

Features ● 13th/12th gen Intel® Core™ i7/i5/i3 or Celeron® processor (Raptor Lake U/Alder Lake U) ● Dual channel DDR4-3200 SO-DIMM for up to 64GB memory ● Up to 12 lanes of PCI Express ● 2 SATA Gen3 ● 4 USB 3.2 and 8 USB 2.0 ● Supports NVMe for up to 512GB ● Supports TPM 2.0

文件:460.65 Kbytes 页数:3 Pages

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技术参数

  • Lef [mm] *:

    52.4

  • Aef [mm2] *:

    194

  • Vef [mm3] *:

    10200

  • AL [nH/turns2]:

    7940±25%

  • Gap [µm]:

    ungapped

  • µe:

    ≈1700

  • ROHS:

    v

供应商型号品牌批号封装库存备注价格
PHI
24+
TSSOP38
103
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23+
模块
120
全新原装正品,量大可订货!可开17%增值票!价格优势!
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100
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16+
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24+
TQFP-144
8762
公司原厂原装现货假一罚十!特价出售!强势库存!
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ELITESILICON
1142+
LQFP
1040
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EST
25+
QFP
5
百分百原装正品 真实公司现货库存 本公司只做原装 可
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23+
模块
5000
原装正品,假一罚十
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ST
24+
mokuai
5000
只做原装公司现货
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EST
23+
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8560
受权代理!全新原装现货特价热卖!
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更多E38供应商 更新时间2026-1-31 10:50:00