丝印：2C152QS；Package：WQFN；DS25CP152Q Automotive 3.125 Gbps LVDS 2x2 Crosspoint Switch

1FEATURES 2• AECQ-100 Grade 3 • DC - 3.125 Gbps Low Jitter, Low Skew, Low Power Operation • Pin Configurable, Fully Differential, Non- Blocking Architecture • On-chip 100Ω Input and Output Terminations Minimize Return Losses, Reduce Component Count and Minimize Board Space • 8 kV ESD on L

文件：448.7 Kbytes 页数：16 Pages

TI

德州仪器

丝印：2C152QS；Package：WQFN；DS25CP152Q Automotive 3.125 Gbps LVDS 2x2 Crosspoint Switch

1FEATURES 2• AECQ-100 Grade 3 • DC - 3.125 Gbps Low Jitter, Low Skew, Low Power Operation • Pin Configurable, Fully Differential, Non- Blocking Architecture • On-chip 100Ω Input and Output Terminations Minimize Return Losses, Reduce Component Count and Minimize Board Space • 8 kV ESD on L

文件：448.7 Kbytes 页数：16 Pages

TI

德州仪器

丝印：2C152QS；Package：WQFN；DS25CP152Q Automotive 3.125 Gbps LVDS 2x2 Crosspoint Switch

1FEATURES 2• AECQ-100 Grade 3 • DC - 3.125 Gbps Low Jitter, Low Skew, Low Power Operation • Pin Configurable, Fully Differential, Non- Blocking Architecture • On-chip 100Ω Input and Output Terminations Minimize Return Losses, Reduce Component Count and Minimize Board Space • 8 kV ESD on L

文件：448.7 Kbytes 页数：16 Pages

TI

德州仪器

丝印：2C152QS；Package：WQFN；DS25CP152Q Automotive 3.125 Gbps LVDS 2x2 Crosspoint Switch

1FEATURES 2• AECQ-100 Grade 3 • DC - 3.125 Gbps Low Jitter, Low Skew, Low Power Operation • Pin Configurable, Fully Differential, Non- Blocking Architecture • On-chip 100Ω Input and Output Terminations Minimize Return Losses, Reduce Component Count and Minimize Board Space • 8 kV ESD on L

文件：448.7 Kbytes 页数：16 Pages

TI

德州仪器

丝印：2C152QS；Package：WQFN；DS25CP152Q Automotive 3.125 Gbps LVDS 2x2 Crosspoint Switch

1FEATURES 2• AECQ-100 Grade 3 • DC - 3.125 Gbps Low Jitter, Low Skew, Low Power Operation • Pin Configurable, Fully Differential, Non- Blocking Architecture • On-chip 100Ω Input and Output Terminations Minimize Return Losses, Reduce Component Count and Minimize Board Space • 8 kV ESD on L

文件：448.7 Kbytes 页数：16 Pages

TI

德州仪器

丝印：2C152SQ；Package：WQFN；DS25CP152 3.125 Gbps LVDS 2x2 Crosspoint Switch

1FEATURES 2• DC - 3.125 Gbps Low Jitter, Low Skew, Low Power Operation • Pin Configurable, Fully Differential, Non- Blocking Architecture • On-Chip 100Ω Input and Output Terminations Minimize Return Losses, Reduce Component Count and Minimize Board Space • 8 kV ESD on LVDS I/O Pins Protect

文件：448.08 Kbytes 页数：16 Pages

TI

德州仪器

丝印：2C152SQ；Package：WQFN；DS25CP152 3.125 Gbps LVDS 2x2 Crosspoint Switch

1FEATURES 2• DC - 3.125 Gbps Low Jitter, Low Skew, Low Power Operation • Pin Configurable, Fully Differential, Non- Blocking Architecture • On-Chip 100Ω Input and Output Terminations Minimize Return Losses, Reduce Component Count and Minimize Board Space • 8 kV ESD on LVDS I/O Pins Protect

文件：448.08 Kbytes 页数：16 Pages

TI

德州仪器

丝印：2C152SQ；Package：WQFN；DS25CP152 3.125 Gbps LVDS 2x2 Crosspoint Switch

1FEATURES 2• DC - 3.125 Gbps Low Jitter, Low Skew, Low Power Operation • Pin Configurable, Fully Differential, Non- Blocking Architecture • On-Chip 100Ω Input and Output Terminations Minimize Return Losses, Reduce Component Count and Minimize Board Space • 8 kV ESD on LVDS I/O Pins Protect

文件：448.08 Kbytes 页数：16 Pages

TI

德州仪器

丝印：2C152SQ；Package：WQFN；DS25CP152 3.125 Gbps LVDS 2x2 Crosspoint Switch

1FEATURES 2• DC - 3.125 Gbps Low Jitter, Low Skew, Low Power Operation • Pin Configurable, Fully Differential, Non- Blocking Architecture • On-Chip 100Ω Input and Output Terminations Minimize Return Losses, Reduce Component Count and Minimize Board Space • 8 kV ESD on LVDS I/O Pins Protect

文件：448.08 Kbytes 页数：16 Pages

TI

德州仪器

DS25CP152 3.125 Gbps LVDS 2x2 Crosspoint Switch

文件：998.05 Kbytes 页数：17 Pages

TI

德州仪器