T1 Dual Framer LIU

DESCRIPTION The DS2196 T1 Dual Framer LIU is designed for T1 transmission equipment. The DS2196 combines dual optimized framers together with a line interface unit. This combination allows the DS2196 user to extract and insert Facility Data Link (FDL) messages in the receive and transmit paths, c

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T1 Dual Framer LIU

DESCRIPTION The DS2196 T1 Dual Framer LIU is designed for T1 transmission equipment. The DS2196 combines dual optimized framers together with a line interface unit. This combination allows the DS2196 user to extract and insert Facility Data Link (FDL) messages in the receive and transmit paths, c

文件：734.11 Kbytes 页数：157 Pages

Dallas

T1 Dual Framer LIU

DESCRIPTION The DS2196 T1 Dual Framer LIU is designed for T1 transmission equipment. The DS2196 combines dual optimized framers together with a line interface unit. This combination allows the DS2196 user to extract and insert Facility Data Link (FDL) messages in the receive and transmit paths, c

文件：734.11 Kbytes 页数：157 Pages

Dallas

4 X 3 Twelve Channel T1 Framer

MULTI-CHIP MODULE (MCM) DESCRIPTION The Four x Four and Four x Three MCMs offer a high density packaging arrangement for the DS21Q42 T1 Enhanced Quad Framer. Either three (DS21FT42) or four (DS21FF42) silicon die of these devices is packaged in a Multi-Chip Module (MCM) with the electrical connec

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4x3 Twelve Channel E1 Framer, 4x4 Sixteen Channel E1 Framer

MULTI-CHIP MODULE (MCM) DESCRIPTION The Four x Four and Four x Three MCMs offer a high density packaging arrangement for the DS21Q44 E1 Enhanced Quad Framer. Either three (DS21FT44) or four (DS21FF44) silicon die of these devices is packaged in a Multi-Chip Module (MCM) with the electrical connec

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Four x Three 12 Channel E1 Framer

DESCRIPTION The DS21FT40 MCM offers a high density packaging arrangement for the DS21Q44 E1 Enhanced Quad Framer. Three DS21Q44 silicon die are packaged in a Multi-Chip Module (MCM) with the electrical connections as shown in Figure 1-1. The DS21FT40 is closely related to the DS21FT44. Most of th

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4 X 3 Twelve Channel T1 Framer

MULTI-CHIP MODULE (MCM) DESCRIPTION The Four x Four and Four x Three MCMs offer a high density packaging arrangement for the DS21Q42 T1 Enhanced Quad Framer. Either three (DS21FT42) or four (DS21FF42) silicon die of these devices is packaged in a Multi-Chip Module (MCM) with the electrical connec

文件：466.17 Kbytes 页数：145 Pages

Dallas

4x3 Twelve Channel E1 Framer, 4x4 Sixteen Channel E1 Framer

MULTI-CHIP MODULE (MCM) DESCRIPTION The Four x Four and Four x Three MCMs offer a high density packaging arrangement for the DS21Q44 E1 Enhanced Quad Framer. Either three (DS21FT44) or four (DS21FF44) silicon die of these devices is packaged in a Multi-Chip Module (MCM) with the electrical connec

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3.3V E1/T1/J1 Line Interface

DESCRIPTION The DS21348 is a complete selectable E1 or T1 LIU for short-haul and long-haul applications. Throughout the data sheet, J1 is represented wherever T1 exists. Receive sensitivity adjusts automatically to the incoming signal and can be programmed for 0dB to 12 dB or 0dB to 43dB for E1

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3.3V E1/T1/J1 Line Interface

DESCRIPTION The DS21348 is a complete selectable E1 or T1 LIU for short-haul and long-haul applications. Throughout the data sheet, J1 is represented wherever T1 exists. Receive sensitivity adjusts automatically to the incoming signal and can be programmed for 0dB to 12 dB or 0dB to 43dB for E1

文件：551.83 Kbytes 页数：73 Pages

Dallas